COF Semiconductor Package Heat Dissipation Zone

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Solution Overview

Problem

Conventional chip-on-film (COF) semiconductor packages face inefficiencies in heat dissipation due to separation of the heat dissipating panel from the insulation substrate under external forces, which reduces the effectiveness of heat dissipation pathways in electronic devices like LCD panels.

Innovation Solution

Incorporating a pressure absorbing zone between the insulation substrate and the heat dissipating component, formed by removing portions of the adhesive component, to absorb externally applied pressure and maintain contact, thereby enhancing heat dissipation efficiency while preventing separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heat dissipating panel is directly attached to the insulation substrate using adhesive, then heat dissipation efficiency is improved, but the panel separates under external forces applied to the chassis

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidattachment stability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent introduces a pressure-absorbing zone between the heat dissipating panel and insulation substrate that acts as a cushioning element. This zone is designed to deform and absorb external forces applied to the chassis before they can cause separation of the panel, thereby maintaining both heat dissipation efficiency and attachment stability simultaneously

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent changes the physical state of the adhesive component by creating a pressure-absorbing zone with different mechanical properties (softer, more compliant) compared to the rigid heat dissipating panel and insulation substrate. This parameter change allows the adhesive zone to deform under external forces while maintaining the bond between components

Inventive Principle:

Principle #35Parameter changes

2Strength

If the adhesive component is made rigid to maintain structural integrity, then mechanical strength is improved, but heat dissipation efficiency decreases due to separation under external forces

Engineering Contradiction:

Improvestructural integrityVSAvoidheat dissipation efficiency

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent applies local quality by creating a pressure-absorbing zone with specific localized properties (softer, more compliant) only in the region where external forces are applied, while the rest of the adhesive component maintains its bonding function. This localized modification allows the structure to absorb shocks without compromising overall structural integrity or heat dissipation

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If the chassis is designed to receive external forces from various directions, then adaptability is improved, but the heat dissipating panel separates from the insulation substrate

Engineering Contradiction:

Improvechassis force receptionVSAvoidpanel attachment

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The pressure-absorbing zone is designed in advance to cushion against external forces from various directions (upward, downward, leftward, rightward). This beforehand cushioning allows the chassis to maintain its adaptability for receiving forces from different directions while preventing panel separation through the compliant zone that absorbs these forces

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The pressure absorbing zone effectively relieves external pressure, ensuring continuous heat dissipation and maintaining the integrity of the heat dissipation path, thereby improving the overall heat dissipation efficiency of the COF semiconductor package.

Implementation Method 1

a pressure absorbing zone between the insulation substrate and the heat dissipating component, formed by removing portions of the adhesive component, to absorb externally applied pressure

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

a heat dissipating panel on a bottom surface of an insulation substrate to dissipate heat generated by a semiconductor device formed on a top surface of the insulation substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8222089B2Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Publication Date: 2012.07.17 SAMSUNG ELECTRONICS CO LTD

AI summary

Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.