COF Film Package Thermal Layout With Resin Through-Holes
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Solution Overview
Problem
Current chip-on-film (COF) package technologies face challenges in heat dissipation and process efficiency, particularly in miniaturized electronic devices, where traditional methods fail to effectively manage heat and optimize design flexibility.
Innovation Solution
The proposed film package incorporates a thermally conductive film and resin with through-holes to enhance heat dissipation, while maintaining visibility of markings and alignment keys through transparent resins, allowing for improved thermal management and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional COF package technology is used, then device miniaturization is achieved, but heat dissipation performance deteriorates
Solution Approach 1:
The packaging structure is divided into multiple functional layers including a protective layer with first and second openings, a thermally conductive resin layer with heat dissipation fillers, and a thermally conductive film with through-holes. This segmentation allows each layer to perform its specific function while collectively improving heat dissipation in the miniaturized device.
Solution Approach 2:
A thermally conductive resin containing heat dissipation fillers is introduced as an intermediary substance between the semiconductor chip and the external environment. This resin fills the first opening and provides a thermal pathway for heat transfer, while the second opening allows alignment markers to be visible for positioning.
2Reliability
If protective layer completely covers wiring pattern, then electrical protection is improved, but alignment and positioning become difficult
Solution Approach 1:
The protective layer is designed with localized openings: the first opening exposes the alignment marker on the semiconductor chip for positioning, while the second opening exposes alignment markers on the protective layer itself. These localized exposures provide reference marks for precise alignment during manufacturing, while the rest of the protective layer maintains its protective function.
3Temperature
If thermally conductive material completely covers chip, then heat dissipation is improved, but visibility of markings and alignment keys is lost
Solution Approach 1:
The thermally conductive resin is applied selectively to fill only the first opening where the semiconductor chip is located, while the second opening remains open to expose alignment markers. This segmented application allows heat dissipation functionality to be provided where needed while maintaining visibility of critical alignment features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves heat dissipation and process efficiency, enabling better thermal performance and design flexibility in miniaturized electronic devices by using thermally conductive films and resins with strategically placed through-holes.
Implementation Method 1
a thermally conductive resin including a first resin disposed on the first opening to cover the semiconductor chip, and a second resin disposed on the second opening; and a thermally conductive film disposed on the protective layer
Data Source
AI summary
A film package includes a film substrate, a semiconductor chip disposed on the film substrate, a wiring pattern electrically connected to the semiconductor chip and including an input pattern and an output pattern, a protective layer disposed on the film substrate to cover at least a portion of the wiring pattern and having a first opening in which the semiconductor chip is disposed, and a second opening spaced apart from the first opening, a thermally conductive resin including a first resin disposed on the first opening to cover the semiconductor chip and a second resin disposed on the second opening, and a thermally conductive film disposed on the protective layer and having a first through-hole exposing a portion of the first resin, and a second through-hole exposing a portion of the second resin.