COF Semiconductor Package With Recessed Heat Radiator for Warpage Control
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high thermal radiation efficiency, compact size, and structural stability, particularly in chip-on-film (COF) packages, which can lead to heat generation and warpage issues due to the mechanical and electrical reliability requirements for small-form-factor devices.
Innovation Solution
The semiconductor package design incorporates a flexible base film with a recess pattern on one surface and a high thermal conductivity heat radiating member buried in the recess, allowing for efficient heat dissipation and structural stability, while maintaining a compact size by strategically placing the heat radiating member below the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional COF package structure is used, then the package can be compact, but thermal radiation efficiency is poor leading to heat generation
Solution Approach 1:
The heat radiating member is positioned in the vertical dimension below the base film rather than expanding the package horizontally. This allows heat dissipation functionality to be added in the Z-direction, improving thermal radiation efficiency without increasing the planar footprint of the compact package.
Solution Approach 2:
The heat radiating member is embedded within the recess pattern of the base film, creating a nested structure where the heat radiating member is positioned inside the recess. This nesting approach allows the heat dissipation component to be integrated into the existing package structure without adding significant volume.
2Volume of moving object
If the base film is made thinner to reduce package size, then compactness is improved, but structural stability and warpage resistance deteriorate
Solution Approach 1:
The base film is constructed as a composite structure combining a flexible polymer material with an embedded heat radiating member. This composite construction provides both the flexibility needed for thin-film applications and the structural rigidity from the heat radiating member that resists warpage, allowing thin base films to maintain stability.
Solution Approach 2:
The heat radiating member is strategically positioned in a recess pattern directly below the semiconductor chip, creating a localized reinforcement zone. This local quality enhancement provides warpage resistance precisely where needed (under the chip area) without requiring the entire base film to be thicker, thus maintaining overall compactness.
3Temperature
If a heat radiating member is added to improve thermal radiation efficiency, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat radiating member is extracted as a separate functional component and positioned in a dedicated recess pattern, rather than attempting to integrate heat dissipation into the base film material itself. This extraction approach simplifies the design by separating thermal management functionality from the structural base film, making the overall package easier to manufacture and analyze.
Solution Approach 2:
The heat radiating member serves multiple functions simultaneously: it provides thermal radiation efficiency for heat dissipation, acts as a structural reinforcement element to prevent warpage, and serves as an anchor for adhesive bonding to secure the base film. This multi-functionality reduces device complexity by consolidating multiple requirements into a single component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal radiation efficiency, reduces package size, and improves warpage resistance and structural stability by effectively managing heat dissipation and mechanical stress, ensuring reliable performance in small-form-factor devices.
Implementation Method 1
a metallic heat radiating member in a lower portion of the base film and below the semiconductor chip
Data Source
AI summary
A semiconductor package includes a flexible base film, a semiconductor chip on a first surface of the base film, and a heat radiating member on a second surface of the base film. The base film has a recess pattern in the second surface. The recess pattern is adjacent the semiconductor chip. The heat radiating member may be in the recess pattern.