Chip on Film Package Structure with Peripheral Code-Included Pattern
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Solution Overview
Problem
Misjudgment or misreading of product information in chip on film (COF) packaging can reduce production line throughput and yield due to the lack of effective data extraction from code-included patterns.
Innovation Solution
A COF package structure incorporating a flexible film with a patterned metal layer, a chip, a patterned solder resist layer, and a code-included pattern on the peripheral region, which includes machine-readable data such as barcodes, allowing for accurate data extraction and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a code-included pattern is added to the COF package structure, then data extraction accuracy and product information management are improved, but device complexity increases
Solution Approach 1:
The COF package structure is divided into distinct functional regions: a chip mounting region for the chip and circuit elements, and a peripheral region for the code-included pattern. This segmentation allows the code pattern to be placed in a dedicated area without interfering with the chip mounting process or circuit functionality, thereby improving data extraction accuracy while minimizing impact on overall structure.
Solution Approach 2:
The code-included pattern acts as an intermediary element that bridges the physical package structure and the digital information system. By incorporating machine-readable codes (such as barcodes or data matrices) in the peripheral region, the package structure enables automatic identification and tracking without requiring changes to the core chip mounting technology, thus improving information management while maintaining structural simplicity.
2Productivity
If machine-readable data is incorporated into the package structure, then productivity and throughput are improved through reduced misjudgment, but manufacturing precision requirements increase
Solution Approach 1:
The code-included pattern is prepared and positioned in the peripheral region during the film fabrication process before the chip mounting step. This preliminary action ensures that the code pattern is already in place and properly positioned when the COF bonding process begins, allowing for automatic identification and reducing misjudgment on the production line without requiring additional precision during chip mounting.
Solution Approach 2:
The code-included pattern is confined to the peripheral region of the flexible film, which has different quality requirements compared to the chip mounting region. The peripheral region can tolerate standard manufacturing variations while still providing sufficient resolution for machine-readable code recognition, thereby improving productivity without imposing stringent precision requirements across the entire package structure.
3Ease of operation
If the code-included pattern is placed on the peripheral region, then ease of operation for data reading is improved, but the area available for chip mounting is reduced
Solution Approach 1:
The flexible film is segmented into two distinct zones: the chip mounting region where chips and circuit elements are placed, and the peripheral region dedicated to the code-included pattern. This spatial segmentation ensures that the code pattern is readily accessible for data reading operations without encroaching on the chip mounting area, as the peripheral region is specifically designed for identification and tracking functions.
Solution Approach 2:
Instead of placing the code pattern in the center or overlapping with the chip mounting area, the code-included pattern is positioned in the peripheral region, utilizing the outer dimensional space of the flexible film. This dimensional arrangement allows simultaneous optimization of both chip mounting area and data reading accessibility, as the peripheral location provides easy access for scanners while preserving central area for electronics.
Data Source
AI summary
A chip on film package structure including a flexible film, a patterned metal layer, a chip, a patterned solder resist layer, and a code-included pattern is provided. The flexible film comprises a chip mounting region and a peripheral region surrounding the chip mounting region. The patterned metal layer disposed on the flexible film. The chip mounted on the chip mounting region and electrically connected to the patterned metal layer. The patterned solder resist layer exposing the chip mounting region and covering a part of the patterned metal layer. The code-included pattern disposed on the peripheral region of the flexible film. The code-included pattern comprises a plurality of machine-readable data. A method for reading a code-included pattern on a package structure is also provided.