Chip-on-Film Routing Layout for Multi-Chip Bonding Pitch

The patent applies dimensionality change by transitioning from a planar two-dimensional arrangement of conductive lines and bonding pads to a three-dimensional configuration that utilizes both the top and bottom surfaces of the base film. Conductive lines are routed on opposite sides of the base film, allowing signals to travel through multiple dimensions rather than being constrained to a single plane. This spatial reconfiguration reduces routing complexity by distributing conductive paths across different layers and surfaces, thereby accommodating multiple semiconductor chips while maintaining predetermined bonding pitch requirements.

The patent implements curvature by replacing traditional linear conductive line patterns with zigzag-shaped conductive lines that extend across the base film. These zigzag patterns provide multiple signal transmission paths between bonding pads, enabling signals to traverse longer distances through curved and angled routes rather than direct linear paths. The curved zigzag configuration increases routing efficiency and signal transmission speed by creating redundant pathways and optimizing signal flow across the base film structure, while remaining compatible with standard manufacturing processes.