COF Semiconductor IC with Resin Sealing for Heat Dissipation
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Solution Overview
Problem
Conventional liquid crystal driving modules with semiconductor integrated circuits mounted on printed circuit boards have low mounting efficiency and high costs due to multiple components, and face challenges in heat dissipation, especially in COF structures which cannot accommodate heat dissipating devices like heat sinks.
Innovation Solution
A semiconductor integrated circuit device with low and high voltage circuit portions formed on a single chip, mounted on a COF substrate with a resin layer for sealing, and utilizing a specific wiring pattern and bump arrangement for efficient heat dissipation through a COF substrate to an external PCB board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor integrated circuits are individually mounted on a printed circuit board, then each circuit can be independently designed and manufactured, but the number of components increases resulting in low mounting efficiency and increased costs
Solution Approach 1:
The patent merges multiple semiconductor integrated circuits (source driver circuit, timing controller, power supply circuit, LED driver circuit) onto a single semiconductor integrated circuit chip. This consolidation reduces the number of components from multiple individual circuits to one integrated chip, thereby improving mounting efficiency and reducing costs while maintaining independent design capabilities for each functional block within the chip.
2Adaptability or versatility
If multiple semiconductor integrated circuits are mounted on a printed circuit board, then functional requirements are met, but component count increases leading to higher costs
Solution Approach 1:
The patent combines five distinct functional circuits (source driver, timing controller, power supply, LED driver, and other necessary circuits) into a single semiconductor integrated circuit chip. This merging reduces the component count from five separate components to one integrated chip, thereby lowering costs and simplifying the overall structure while maintaining all required functions.
Solution Approach 2:
The single semiconductor integrated circuit chip performs multiple functions that were previously distributed across different components. The chip universally handles source driving, timing control, power supply management, and LED driving functions, making the system more compact and cost-effective while maintaining full functionality.
3Device complexity
If high voltage circuit portions are formed on a chip, then integration is improved, but heat dissipation becomes more difficult especially in COF structures
Solution Approach 1:
The patent segments the semiconductor integrated circuit chip into distinct low voltage circuit portions and high voltage circuit portions. This segmentation allows for targeted heat management strategies where high voltage circuits generating more heat can be positioned and cooled differently from low voltage circuits, while maintaining overall integration benefits.
Solution Approach 2:
The patent applies local quality by providing different thermal management approaches for different regions of the chip. High voltage circuit portions that generate more heat are given priority in heat dissipation design, with specific attention to thermal pathways and cooling structures in those regions, while low voltage regions use standard thermal management.
4Productivity
If low and high voltage circuit portions are formed on a single chip, then mounting efficiency is improved, but heat management complexity increases
Solution Approach 1:
The patent divides the single chip into distinct low voltage and high voltage circuit portions with clear spatial separation. This segmentation simplifies heat management by allowing independent thermal design for each portion, reducing the overall complexity compared to a fully integrated design without regional differentiation.
Solution Approach 2:
The patent implements local quality by applying different thermal management strategies to different regions of the chip. High voltage regions receive enhanced heat dissipation attention while low voltage regions use standard management, thereby managing heat complexity efficiently while maintaining the benefits of integrated mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves mounting efficiency, reduces component count and costs, and effectively dissipates heat from high voltage circuit portions, preventing temperature increases and image disturbances in display apparatuses.
Implementation Method 1
a resin layer for sealing the COF substrate and the semiconductor integrated circuit
Implementation Method 2
dissipates heat from the high voltage circuit portion efficiently
Data Source
AI summary
A semiconductor integrated circuit device includes a COF substrate; a semiconductor integrated circuit mounted on the COF substrate and having a first voltage circuit portion operating at a first voltage range and a second voltage circuit portion operating at a second voltage range higher than the first voltage range, the circuit portions being formed on a single chip; and a resin layer for sealing the COF substrate and the semiconductor integrated circuit.