COF Package Sub-Module Layout for Fine-Pitch Chip Protection

The patent divides the COF semiconductor package into multiple independent sub-modules (first sub-module, second sub-module, etc.), each containing its own semiconductor chip and conductive wire connections. This segmentation allows each module to be processed and mounted independently, reducing stress concentration and preventing deformation across the entire package when implementing fine pitch metal patterns.

The patent introduces a film substrate as an intermediary layer between the semiconductor chips and the external environment. This film substrate provides mechanical support and stress distribution, acting as a buffer that prevents direct transmission of deformation forces to the semiconductor chips and conductive wires during fine pitch implementation.

The patent segments the package structure into multiple independent sub-modules, each with its own semiconductor chip mounted on the film substrate. This segmentation distributes the thermal and mechanical stresses across separate modules rather than concentrating them on a single large substrate, thereby maintaining substrate flatness while achieving high integration density through multiple modules.

The patent applies different structural configurations to different regions of the package. Each sub-module can have optimized local structures (such as varying conductive wire layouts, chip orientations, or mounting positions) that are specifically designed to minimize warpage in that particular region, while the overall package achieves high integration density through the combination of multiple such locally-optimized modules.