COF Tape Substrate Segmented Package Units for LCD Circuit Density
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Solution Overview
Problem
Conventional tape substrates with chip on film (COF) structures for liquid crystal display panels have a limited width, which restricts the high circuit density required for large-sized LCD panels, especially due to the limited number and arrangement of output leads.
Innovation Solution
The proposed solution involves a tape substrate with COF structures where multiple package units are arranged along the longitudinal direction, each containing input and output leads disposed on both sides of the substrate, allowing for increased width and flexibility in lead arrangement to meet high circuit density needs by positioning adjacent input leads on the same or different sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the tape substrate width is increased to accommodate more output leads, then the circuit density is improved, but the manufacturing complexity and structural stability are worsened
Solution Approach 1:
The tape substrate is divided into multiple segments along the longitudinal direction, with each segment containing a specific number of package units (e.g., 2-4 units). This segmentation allows the substrate to maintain manageable width while accommodating the required number of leads through multiple segments, rather than increasing the width of a single continuous substrate.
Solution Approach 2:
Instead of arranging all package units in a single row along the width of the substrate, the invention utilizes the longitudinal dimension by arranging multiple segments sequentially. This transforms the problem from a two-dimensional width constraint to a three-dimensional arrangement involving length and width, effectively increasing capacity without excessive width increase.
2Quantity of substance
If the tape substrate width is increased to accommodate more output leads, then the circuit density is improved, but the manufacturing precision is worsened
Solution Approach 1:
By dividing the substrate into segments with limited numbers of package units each, the manufacturing precision requirement for each segment remains manageable. Each segment can be manufactured and assembled with standard precision levels, avoiding the need for extremely high precision that would be required for a single wide substrate containing all leads.
Solution Approach 2:
Each segment is designed with specific local characteristics, including the arrangement of package units and leads within that segment. This allows optimization of lead spacing and routing within each manageable segment, maintaining high manufacturing precision locally while achieving high overall circuit density through the combination of multiple segments.
Data Source
AI summary
The present invention provides a tape substrate with COF structures for a liquid crystal display panel. A plurality of package units with the COF structures are arranged along a longitudinal direction of the tape substrate. Each of the package units includes input leads and output leads. In each of the package units, along the longitudinal direction of the tape substrate, the input leads and the output leads are disposed at both sides of the tape substrate, respectively. The present invention further provides the liquid crystal display panel using the tape substrate.