COG Chip Thickness Reduction via Protective Fixing Member
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Solution Overview
Problem
Existing liquid crystal display devices face challenges in achieving a low profile due to the thickness of the COG chip and other components, which hinders the miniaturization of portable terminals, and previous solutions either fail to reduce the thickness effectively or complicate the manufacturing process.
Innovation Solution
A display device structure where the semiconductor chip's thickness is equal to or smaller than the total thickness of the seal member and the second substrate, with a protective fixing member optionally used to secure the chip and substrates, allowing for simultaneous polishing to achieve a uniform and reduced thickness, thereby determining the panel's thickness based on the device structure in the display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the COG chip thickness is reduced to achieve a low-profile display device, then the overall device thickness is reduced, but the mechanical strength and reliability of the chip mounting structure deteriorate
Solution Approach 1:
A protective fixing member is introduced as an intermediary component between the COG chip and the first substrate. This member provides mechanical support and reinforcement to the chip mounting structure, ensuring adequate strength and reliability while allowing the COG chip itself to have reduced thickness for achieving a low-profile display device
Solution Approach 2:
The chip mounting structure is segmented into distinct functional components: the COG chip, the protective fixing member, and the first substrate. This segmentation allows each component to be optimized independently - the COG chip can be thin for profile reduction while the protective fixing member provides the necessary mechanical strength
2Manufacturing precision
If the COG chip thickness is made smaller than the total thickness of the seal member and second substrate, then simultaneous polishing can be performed to achieve uniform thickness, but the complexity of coordinating thickness specifications and polishing processes increases
Solution Approach 1:
The thickness specifications of the COG chip, seal member, and second substrate are predetermined during the design phase such that the COG chip thickness is smaller than the total thickness of the seal member and second substrate. This preliminary planning enables subsequent simultaneous polishing to achieve uniform overall thickness without requiring complex real-time adjustments during manufacturing
Data Source
AI summary
Disclosed herein is a display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.