COG Panel Test Lead Layout for Multi-Point Resistance Measurement
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Solution Overview
Problem
In electronic apparatuses using the COG method, increased connection resistance between the integrated circuit and the electronic panel can deteriorate panel performance, necessitating post-manufacturing resistance measurement.
Innovation Solution
An electronic apparatus design that reduces the number of terminals for measuring connection resistance, allowing for multi-point measurements with fewer terminals and a reduced circuit board size by using a configuration of test lead groups and terminals, including a conductive adhesive member to connect the panel and circuit board, and a bump part overlapping the pad part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple terminals are used to measure connection resistance at multiple points, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple test lead functions into fewer terminals by using a shared terminal configuration. Specifically, one terminal serves as a common reference point for multiple resistance measurements, allowing connection resistance to be measured at multiple points (between first and second pad parts, between first and third pad parts) using the same physical terminal rather than requiring separate terminals for each measurement point.
Solution Approach 2:
The shared terminal acts as a universal reference point that can be used for multiple different resistance measurement operations. This multi-functional terminal enables the system to perform various connection resistance measurements (different pad part combinations) without requiring dedicated terminals for each specific measurement, thereby reducing the total terminal count while maintaining measurement capabilities.
2Measurement precision
If more terminals are added to the circuit board for resistance measurement, then measurement capability is improved, but the circuit board area increases
Solution Approach 1:
The patent merges the functions of multiple potential terminals into a smaller number of actual terminals on the circuit board. By using a shared terminal that serves multiple measurement purposes, the physical space required for terminal placement is reduced, thereby decreasing the overall circuit board area while still enabling comprehensive connection resistance measurement capability.
3Area of stationary object
If the number of terminals is reduced, then device size is decreased, but measurement capability may be compromised
Solution Approach 1:
The reduced set of terminals is designed with universal functionality where the shared terminal can be configured to work with different test lead groups for measuring resistance between various pad part combinations. This multi-functional design ensures that despite having fewer terminals, the system maintains the capability to measure connection resistance across multiple critical points in the electronic apparatus.
Solution Approach 2:
The measurement system is segmented into different test lead groups (first test lead group, second test lead group) that can be selectively connected to the shared terminal. This segmentation allows the same terminal to serve different measurement functions by connecting to different test lead groups, thereby maintaining comprehensive measurement capability with reduced terminal count.
Data Source
AI summary
An electronic apparatus includes an electronic panel including a first pad part and a second pad part having a portion electrically connected to the first pad part, a driving circuit including a bump part overlapping the first pad part in a plan view, and a circuit board including a lead part overlapping the second pad part in a plan view. The lead part including a plurality of test leads includes a first test lead group electrically connected to the first pad part, and a second test lead group insulated from the first pad part, and one test lead of the first test lead group and one test lead of the second test lead group are electrically connected to each other.