Coherent Fiber Bundle Links for Dense, Low-Power MicroLED Interconnects

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Solution Overview

Problem

The limitations of chip-to-chip connections in optical links, including increased power consumption and reduced density, are exacerbated by the coupling of optical sources and detectors to waveguides, which dominate the cost and limit their integration density.

Innovation Solution

The use of coherent fiber bundles (CFBs) comprising tightly packed fibers for optical links between microLED transmitters and photodetectors, maintaining coherence within sub-bundles and employing spatially-sampled optical distribution to enhance alignment tolerances and reduce crosstalk, along with switchable photodetectors for improved signal recovery.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If chip-to-chip connections are used for optical links, then integration density is improved, but power consumption increases and coupling cost increases

Engineering Contradiction:
Improveintegration densityVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The system segments the optical link into multiple independent fiber channels within a coherent fiber bundle, allowing parallel data transmission. Each fiber acts as an independent channel that can be coupled to separate optical sources and detectors, enabling high-density integration without requiring complex chip-to-chip connections for each signal path.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The coherent fiber bundle serves as an intermediary component between optical sources and detectors. Instead of direct chip-to-chip coupling, the fiber bundle mediates the optical signal transmission, allowing multiple signals to be transmitted through a single integrated component, thereby reducing overall power consumption and coupling complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If chip-to-chip connections are used for optical links, then integration density is improved, but coupling cost increases

Engineering Contradiction:
Improveintegration densityVSAvoidcoupling cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The invention merges multiple optical coupling operations into a single coherent fiber bundle interface. Instead of individually coupling multiple optical sources and detectors to separate waveguides, the system combines all coupling operations at the fiber bundle ends, significantly reducing manufacturing complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The coherent fiber bundle serves multiple functions simultaneously: it acts as both the optical transmission medium and the coupling interface for multiple signals. This multi-functionality eliminates the need for separate coupling mechanisms for each signal path, thereby reducing overall coupling cost and improving ease of manufacture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If optical sources and detectors are coupled to waveguides, then optical link functionality is achieved, but density is limited

Engineering Contradiction:
Improveoptical link functionalityVSAvoiddensity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system transitions from planar chip-to-chip connections to three-dimensional fiber bundle integration. By utilizing the spatial dimension of the fiber bundle, multiple optical sources and detectors can be coupled in a compact arrangement, achieving high density while maintaining reliable optical link functionality through the coherent fiber transmission medium.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

CFBs enable high-density, low-power chip-to-chip optical interconnects with reduced packaging costs and increased yield by optimizing alignment and minimizing crosstalk, thereby supporting high-data-rate communications.

Implementation Method 1

A microLED may be generally defined as a LED with a diameter of 1 m at >1 Gbps with lower drive power and very high density

Methodology Applied
Scientific EffectLight Emitting Diode: Light Emitting Diode

Implementation Method 2

a fiber bundle comprised of a plurality of sub-bundles, each sub-bundle comprised of a plurality of multimode fibers

Methodology Applied
Scientific EffectOptical Fibre: Optical Fibre

Implementation Method 3

an optical receiver array including a plurality of optical receiver sub-arrays, each optical receiver sub-array of the plurality of optical receiver sub-arrays comprising a plurality of photodetectors

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS12395247B2Coherent fiber bundle parallel optical links
Publication Date: 2025.08.19 AVICENATECH CORP
  • US12395247B2 patent drawing
  • US12395247B2 patent drawing
  • US12395247B2 patent drawing

AI summary

A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.