Coherent Optical Interconnect Coupling for Dense Chip Packaging
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Solution Overview
Problem
Existing optical interconnects for high-performance computing face limitations in data rate, packaging complexity, and cost, particularly in pluggable designs, and lack the efficiency of coherent schemes for high-bandwidth and energy-efficient data transmission.
Innovation Solution
Implementing coherent optical interconnects with in-plane and out-of-plane signal propagation using integrated photonics, including laser devices, modulators, couplers, and digital signal processors, and utilizing co-packaging and latticed grating couplers for high data rates and efficient energy use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If pluggable optical interconnect designs are used, then ease of operation and adaptability are improved, but device complexity and packaging cost increase
Solution Approach 1:
The patent merges the optical interconnect functionality directly into the chip package by integrating the modulator unit, optical coupler, and signal processing circuits within the same package structure. This eliminates the need for separate pluggable optical modules while maintaining ease of operation through simplified on-chip integration.
Solution Approach 2:
The patent transitions from planar in-plane signal propagation to three-dimensional out-of-plane optical coupling through vertical waveguide structures. This dimensional change enables compact packaging while maintaining high-speed optical communication capabilities, resolving the contradiction between ease of operation and packaging complexity.
2Device complexity
If conventional optical interconnects are used, then device complexity is reduced, but data transmission bandwidth and energy efficiency deteriorate
Solution Approach 1:
The patent employs composite photonic structures combining waveguide materials with high refractive index contrast to enable compact bending radii and efficient optical coupling. This allows high-bandwidth transmission within a compact footprint, maintaining manageable device complexity while achieving superior data transmission performance.
Solution Approach 2:
The patent pre-modulates optical signals with multiple wavelengths and encodes data in the temporal domain before transmission. This preliminary signal preparation enables high data rates through wavelength-division multiplexing and advanced modulation schemes, achieving high bandwidth without proportionally increasing device complexity.
3Productivity
If coherent optical modulation is implemented, then data transmission bandwidth and energy efficiency are improved, but device complexity increases
Solution Approach 1:
The patent segments the coherent optical modulation function into separate functional blocks: a modulator unit for optical signal generation, a first optical coupler for signal coupling, and integrated signal processing circuits. This segmentation allows each component to be optimized independently, achieving high data transmission bandwidth while managing overall device complexity through modular design.
4Device complexity
If in-plane signal propagation is used, then device complexity is reduced, but area efficiency and data transmission performance deteriorate
Solution Approach 1:
The patent transitions from two-dimensional in-plane waveguide propagation to three-dimensional out-of-plane optical coupling through vertical waveguide structures. This dimensional transition enables compact area efficiency by utilizing the vertical space for optical signal transmission, achieving high data transmission performance within a reduced footprint.
Solution Approach 2:
The patent employs curved waveguide structures with optimized bending radii to enable compact optical paths. These curved geometries allow efficient optical coupling and signal propagation within a compact area, improving area efficiency while maintaining manageable device complexity through careful curvature design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances data transmission bandwidth, reduces energy consumption, and simplifies packaging by enabling high-performance computing with improved area efficiency and lower costs.
Implementation Method 1
a laser device configured to generate a source optical signal
Implementation Method 2
a modulator unit configured to modulate the source optical signal and to generate a modulated optical signal
Implementation Method 3
a first optical coupler configured to couple a transmitted optical signal having the modulated optical signal out of the transmitter unit
Implementation Method 4
a demodulator unit configured to receive the transmitted optical signal and a reference optical signal and generate a demodulated electrical signal
Data Source
AI summary
An optical interconnect includes a transmitter unit and a receiver unit. The transmitter unit includes a laser device configured to generate a source optical signal; a modulator unit configured to modulate the source optical signal and to generate a modulated optical signal having an in-phase component and a quadrature component; and a first optical coupler configured to couple a transmitted optical signal having the modulated optical signal, where the source optical signal and the modulated optical signal propagate in-plane along a surface of the transmitter unit, and where the transmitted optical signal propagates out-of-plane from the surface of the transmitter unit. The receiver unit includes a second optical coupler to couple the transmitted optical signal into the receiver unit; and a demodulator unit to receive the transmitted optical signal and a reference optical signal, and generate a demodulated electrical signal having the in-phase and the quadrature components.