Monolithic Coherent Optical Receiver Integration
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Solution Overview
Problem
Existing coherent optical receivers require separate fabrication and packaging of variable optical attenuators, polarization beam splitters, and optical hybrids, leading to increased module size and manufacturing costs due to individual component integration.
Innovation Solution
Integration of a variable optical attenuator, polarization beam splitter, and optical hybrid in a single substrate, with simultaneous formation of a trench in the attenuator and a slit in the beam splitter, using a fabrication method that includes etching processes to monolithically integrate these elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If variable optical attenuator, polarization beam splitter, and optical hybrid are individually fabricated and integrated, then each component can be separately optimized, but the module size increases and manufacturing cost increases
Solution Approach 1:
The patent merges the variable optical attenuator, polarization beam splitter, and optical hybrid into a single integrated optical circuit on one substrate. This consolidation eliminates the need for separate fabrication and packaging of individual components, thereby reducing the overall module size while maintaining the functional optimization of each component through dedicated design regions within the integrated structure.
Solution Approach 2:
The integrated optical circuit serves multiple functions simultaneously - it performs optical signal attenuation, polarization beam splitting, and optical hybridization in a single device. This multi-functionality allows the system to achieve the performance of multiple separate components while occupying the space of a single compact module.
2Reliability
If variable optical attenuator, polarization beam splitter, and optical hybrid are individually fabricated and integrated, then each component can be separately optimized, but manufacturing cost increases
Solution Approach 1:
By combining multiple optical components into a single integrated circuit fabricated on one substrate using semiconductor manufacturing processes, the patent eliminates the need for separate fabrication, packaging, and assembly steps for each component. This significantly reduces manufacturing complexity and cost while maintaining the ability to optimize each functional region during the design phase.
3Manufacturing precision
If trench and slit are formed in separate processes, then each feature can be precisely controlled, but fabrication complexity increases and manufacturing cost increases
Solution Approach 1:
The patent combines the formation of the trench and the slit into a single etching process step. By designing the etching pattern to simultaneously create both features, the invention reduces the number of fabrication steps while maintaining precise control over the dimensions and positions of both the trench and slit through a unified process parameter set.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies packaging, reduces costs, minimizes polarization dependence, lowers power consumption, and enhances the polarization extinction ratio, while stabilizing the performance of optical circuit elements by integrating multiple functions in a single substrate.
Implementation Method 1
a wavelength plate inserted to the slit
Implementation Method 2
signal and local input waveguides extending in a first direction parallel to a top surface of the substrate and configured to receive an optical signal
Data Source
AI summary
Provided are a coherent optical receiver and a fabrication method thereof, the coherent optical receiver including a substrate, signal and local input waveguides extending in a first direction parallel to a top surface of the substrate and configured to receive an optical signal, a first optical circuit element including a first optical waveguide connected to the signal input waveguide and a trench provided in one side of the first optical waveguide in parallel to the first direction, a second optical circuit element including a second optical waveguide connected to the first optical waveguide, a slit crossing the second optical waveguide, and a wavelength plate inserted to the slit, and third optical circuit elements connected to the second optical circuit element, wherein the first to third optical circuit elements are monolithically integrated in the substrate.