Coil Component Asymmetrical Conductor Layer Plating Uniformity
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Solution Overview
Problem
Existing coil components face challenges in achieving both miniaturization and high performance while maintaining reliability, particularly due to asymmetrical plating issues that lead to uneven thickness and spacing between coil patterns, affecting the reliability and performance of the component.
Innovation Solution
A coil component design featuring a planar spiral shape with a second conductor layer having a lower surface area greater than the upper surface area, ensuring uniform volume distribution, and a third conductor layer formed to cover the second conductor layer uniformly, addressing the plating solution supply bottleneck and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional symmetrical coil pattern is used, then the manufacturing process is simple, but the plating thickness becomes uneven and reliability decreases
Solution Approach 1:
The patent applies asymmetry by designing the second conductor layer with different widths at the upper and lower portions. Specifically, the lower portion width is greater than the upper portion width, creating an asymmetrical cross-sectional shape. This asymmetrical design compensates for the plating solution supply bottleneck, ensuring uniform plating thickness throughout the coil pattern and thereby improving manufacturing reliability.
2Volume of moving object
If the coil component is miniaturized, then electronic device thinness is achieved, but plating uniformity becomes difficult to maintain
Solution Approach 1:
The patent applies local quality by varying the width of the second conductor layer at different locations. The lower portion has a greater width than the upper portion, creating local structural differences. This local variation in width compensates for the reduced plating solution flow path in miniaturized components, ensuring that plating thickness remains uniform even when the overall component size is reduced.
3Ease of manufacture
If the second conductor layer has equal upper and lower widths, then the manufacturing process is simple, but plating solution supply becomes bottlenecked
Solution Approach 1:
The patent resolves this contradiction by introducing asymmetry in the second conductor layer design. Instead of equal widths, the lower portion width is deliberately made greater than the upper portion width. This asymmetrical configuration optimizes plating solution distribution by providing adequate flow path width at the lower portion where the bottleneck occurs, while maintaining manufacturability through a single-layer formation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures symmetrical volume distribution across the coil patterns, improving the reliability and performance of the coil component by maintaining uniform plating thickness, even in miniaturized models, and enhancing the inductance characteristics.
Implementation Method 1
asymmetrical plating, uniform volume distribution, plating solution supply bottleneck
Implementation Method 2
uniform plating thickness, covering the second conductor layer uniformly
Data Source
AI summary
A coil component includes a body including a magnetic material; a support member disposed in the body; and a coil pattern on the support member in the body. The coil pattern may include a first conductor layer formed on the support member and having a planar spiral shape; a second conductor layer formed on the first conductor layer and having a volume of a lower portion greater than a volume of an upper portion; and a third conductor layer formed to cover the second conductor layer from the outside of the second conductor layer.