Electromagnetic Induction Coil Binding for Thin Antenna Boards
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Solution Overview
Problem
Conventional methods for fabricating electromagnetic induction digitizer antenna boards face challenges such as high production costs, low yield rates, complex and expensive equipment, inconsistent product quality, and thick antenna boards, along with issues like wire curvature and numerous bridging connections.
Innovation Solution
A method using a computer-aided embroidery machine or similar equipment to bind conductive wires onto a substrate with predetermined intervals, employing elastic threads and a glue dispenser to create overlapping electromagnetic induction coils on a single layer, reducing thickness and improving efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If ultrasonic embedding technology is used to implant coils inside the substrate, then the antenna board can be fabricated with lower cost, but the working efficiency becomes very low due to too many intersection points being skipped
Solution Approach 1:
The patent extracts the conductive wires from the substrate surface and binds them externally using binding wires. This eliminates the need for ultrasonic embedding at intersection points, thereby maintaining low fabrication costs while avoiding the efficiency loss caused by skipping intersection points during embedding processes.
Solution Approach 2:
The patent transitions from embedding wires within the substrate (3D embedding) to binding wires on the substrate surface (2D binding). This dimensional change allows intersection points to be handled without skipping, as the binding process occurs on the surface rather than within the substrate volume.
2Productivity
If non-overlapping coils are disposed in the same layer with multiple layers compressed into an antenna board, then the number of intersection points is reduced, but the antenna board becomes much thicker
Solution Approach 1:
The patent merges multiple coil layers into a single layer by binding conductive wires directly on the substrate surface. This consolidation eliminates the need for multiple compressed layers, reducing the antenna board thickness while managing intersection points through the binding technique rather than layer stacking.
Solution Approach 2:
The patent uses flexible binding wires to dynamically adjust and secure conductive wires at intersection points. This dynamic binding approach allows coils to overlap in the same layer without requiring additional layer compression, maintaining a thin profile while reducing intersection complexity.
3Manufacturing precision
If conventional printing technology is used to fabricate electromagnetic induction antennas, then multiple layers of printed circuits can be stacked, but the cost becomes very high and it is very difficult to fabricate large-size antennas
Solution Approach 1:
The patent replaces the conventional printing process with a mechanical binding process using binding wires. This substitution allows for large-size antenna fabrication without the high costs and limitations of printing technology, while maintaining precise coil positioning through the physical binding mechanism.
Solution Approach 2:
The patent changes the fabrication approach from printing (chemical/depositional process) to binding (mechanical process). This parameter change enables cost-effective fabrication of large-size antennas while preserving the precision needed for coil positioning through controlled binding operations.
4Area of stationary object
If manual coiling method is used with automatic coiling of metal wires, then large-size electromagnetic induction digitizer can be realized, but the equipment becomes complicate for operation, not reliable, and hard for maintenance
Solution Approach 1:
The patent extracts the complex automatic coiling mechanism and replaces it with a simpler binding wire process. This extraction maintains the capability to create large-size digitizers while eliminating the operational complexity, reliability issues, and maintenance difficulties associated with complex automatic coiling equipment.
Solution Approach 2:
The patent uses simple, inexpensive binding wires instead of complex, expensive automatic coiling equipment. This approach achieves large-size digitizer fabrication with minimal equipment investment, avoiding the complexity and maintenance burden of sophisticated coiling machines.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces production costs, enhances yield rates, simplifies equipment complexity, and produces thinner antenna boards with improved consistency and positioning accuracy, addressing the limitations of existing technologies.
Implementation Method 1
electromagnetic induction digitizer antenna board adapted for handwriting input
Data Source
AI summary
A method for fabricating an electromagnetic induction digitizer antenna board that includes the steps of: a. preparing a substrate that is convenient for being holed; b. providing a consecutive wire leading-out terminal at one side of the substrate; c. moving the substrate relative to the consecutive wire leading-out terminal along with a predetermined track of the electromagnetic induction coil of the induction digitizer antenna board, so that the consecutive wire leading-out terminal gets in surface-contact with the substrate, and configures the electromagnetic induction coil on the substrate; d. binding the conductive wire of the electromagnetic induction coil with the substrate at every predetermined interval.