Coil Component Structure Using Capacitive Coupling for HF Noise
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Solution Overview
Problem
As electronic devices become smaller and operate at higher frequencies, coil components face increased challenges with high-frequency noise, which existing technologies struggle to effectively mitigate.
Innovation Solution
A coil component design featuring a body with a coil portion, external electrodes, a dielectric layer, and a third external electrode, which utilizes capacitive-coupling to efficiently remove high-frequency noise through the placement of the dielectric layer and third external electrode to enhance capacitive-coupling with the coil portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic devices are miniaturized and operate at higher frequencies, then device performance and integration are improved, but high-frequency noise increases
Solution Approach 1:
A dielectric layer is introduced as an intermediary between the coil portion and the third external electrode to enable capacitive coupling. This dielectric mediator allows the third external electrode to effectively interact with the coil portion for noise removal without direct contact, resolving the contradiction by providing a controlled coupling mechanism that targets high-frequency noise while maintaining device miniaturization
Solution Approach 2:
The invention changes the electrical parameters by introducing a third external electrode configured to be capacitively coupled to the coil portion through the dielectric layer. This parameter change enables the system to address high-frequency noise without altering the fundamental miniaturized structure, allowing noise removal functionality to be added while maintaining small device dimensions
2Object-affected harmful factors
If a third external electrode is added to remove high-frequency noise, then noise removal capability is improved, but device complexity increases
Solution Approach 1:
The third external electrode is designed to serve multiple functions: it acts as a noise removal electrode through capacitive coupling with the coil portion, while also being integrated into the overall electrode structure of the electronic component. The dielectric layer serves dual purposes as both an insulator and a capacitive coupling medium, reducing overall structural complexity despite adding noise removal functionality
Solution Approach 2:
The dielectric layer is selectively positioned only where needed to provide capacitive coupling between the coil portion and the third external electrode, rather than being applied universally across the entire device. This localized approach minimizes the impact on overall device complexity while effectively addressing high-frequency noise in the specific region where it occurs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively removes high-frequency noise by enhancing capacitive-coupling between the coil portion and the third external electrode, improving noise removal capabilities in compact electronic devices.
Implementation Method 1
a dielectric layer disposed on a surface of the body, and a third external electrode disposed on the surface of the body having the dielectric layer disposed thereon
Data Source
AI summary
A coil component includes a body, a coil portion disposed in the body and having first and second lead-out portions exposed to at least one surface of the body to be spaced apart from each other, first and second external electrodes disposed on the at least one surface of the body to be spaced apart from each other, and respectively connected to the first and second lead-out portions, a dielectric layer disposed on a surface of the body, and a third external electrode disposed on the surface of the body having the dielectric layer disposed thereon to be spaced apart from each of the first and second external electrodes, and covering the dielectric layer.