Coil Component Alternating Resin Insulating Layers

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Solution Overview

Problem

Multilayer-type coil components often suffer from internal defects such as cracks due to stress accumulation from heat loads during production and mounting processes, primarily caused by the difference in coefficients of linear expansion between insulating and conductive layers, with resin insulating layers being particularly prone to stress due to their larger expansion coefficients.

Innovation Solution

A coil component design featuring a multilayer body with alternately laminated non-photosensitive and photosensitive resin insulating layers, where the non-photosensitive layers have a smaller coefficient of linear expansion, allowing for stress release and reducing the occurrence of internal defects like cracks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a photosensitive resin insulating layer with a large coefficient of linear expansion is used, then the insulating layer can be effectively formed and patterned, but stress accumulates during heat load processes causing internal defects such as cracks

Engineering Contradiction:
Improveinsulating layer formationVSAvoidinternal defect occurrence
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent uses a composite resin insulating layer comprising a photosensitive resin component and a non-photosensitive resin component. This composite structure allows the layer to maintain the patterning capability of photosensitive resins while the non-photosensitive component reduces the overall coefficient of linear expansion, thereby reducing stress accumulation and preventing cracks during heat load processes.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical composition parameters of the resin insulating layer by incorporating a non-photosensitive resin component with different thermal expansion characteristics. This parameter change reduces the coefficient of linear expansion of the overall insulating layer, allowing it to better match the conductive layers and reduce stress during thermal processing.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the coefficient of linear expansion of the insulating layer is reduced to match the conductive layer, then stress accumulation is minimized, but the ease of forming and patterning the insulating layer may be compromised

Engineering Contradiction:
Improvestress reductionVSAvoidinsulating layer patterning
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The composite resin insulating layer combines the advantages of both photosensitive and non-photosensitive resins. The photosensitive component enables effective UV-based patterning and formation processes, while the non-photosensitive component reduces the coefficient of linear expansion. This composite approach maintains manufacturing ease while achieving stress reduction.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies different resin components in a composite structure where the photosensitive resin provides the necessary reactivity for patterning in specific regions, while the non-photosensitive resin provides thermal stability throughout the layer. This local differentiation of material properties allows simultaneous achievement of ease of formation and stress reduction.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The alternation of resin insulating layers effectively suppresses the occurrence of internal defects by releasing stress in the layers with higher expansion coefficients, improving the precision and reliability of the coil component.

Implementation Method 1

each of the insulating layers used in the above-described coil component has a coefficient of linear expansion different from that of each of the coil conductive layers. Thus, stress is accumulated by heat load exerted in a producing process and a mounting process

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS11495397B2Coil component
Publication Date: 2022.11.08 MURATA MFG CO LTD
  • US11495397B2 patent drawing
  • US11495397B2 patent drawing
  • US11495397B2 patent drawing

AI summary

A coil component includes a multilayer body in which a plurality of resin insulating layers are laminated in a lamination direction and coil conductive layers disposed inside the multilayer body. The plurality of resin insulating layers includes non-photosensitive first resin insulating layers and photosensitive second resin insulating layers. The multilayer body has a section where the first resin insulating layers and the second resin insulating layers are alternately laminated.