Coil Component Lead-Out Pattern Bonding via Insulating Film Opening
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Solution Overview
Problem
Conventional thin film inductors face weakened bonding force between the lead-out pattern and the body due to the insulating film, which is exacerbated by the increasing relative area occupied by the lead-out pattern, compromising the reliability of the coil component.
Innovation Solution
A coil component design that includes a body with a supporting substrate, a coil portion, and an insulating film between the coil and the body, where at least a portion of the lead-out pattern contacts the body through an opening in the insulating film, enhancing the bonding force by exposing the lead-out pattern's corner portions and improving surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating film is disposed between the coil portion and the body for electrical insulation, then electrical insulation between the coil and the body is improved, but bonding force between the lead-out pattern and the body is weakened
Solution Approach 1:
The insulating film is selectively disposed only in specific regions where electrical insulation is needed, while leaving other regions free for strong bonding. This local differentiation allows the insulating film to provide electrical insulation between the coil portion and body without compromising the bonding force between the lead-out pattern and body, as the bonding areas remain free of the insulating film's interfering effects
2Area of moving object
If the relative area occupied by the lead-out pattern in the body increases, then electrical connection area is improved, but bonding force is weakened due to the insulating film
Solution Approach 1:
The insulating film is localized to specific regions, allowing larger lead-out pattern areas to be exposed and bonded directly to the body where needed, while maintaining electrical insulation only in the specific regions where the insulating film is present
Data Source
AI summary
A coil component includes a body; a supporting substrate embedded in the body; a coil portion including a coil pattern, and a lead-out pattern exposed to an outside of the body through an external surface of the body, and disposed on the supporting substrate and embedded in the body; and an insulating film disposed between the coil portion and the body, wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.