Coil Component Bonding via Surface Roughness and Filler Embedding
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Solution Overview
Problem
Existing coil components for electronic devices face challenges in achieving high impact resistance and strong bonding between drum and planar cores, particularly in maintaining mechanical strength and inductance characteristics under varying adhesive conditions.
Innovation Solution
A coil component design featuring a drum core and planar core bonded using an adhesive with an organic material and filler, where the surface roughness of the drum core's bonding face is higher than the average grain size of the filler, allowing for improved mechanical strength and reduced magnetic gap, thereby enhancing bonding strength and inductance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If grooves are formed in the bonding surface and adhesive is filled to strengthen bonding, then bonding strength is improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The invention changes the surface roughness parameter of the bonding face to be higher than the average grain size of the filler particles. This parameter change allows the adhesive to naturally embed into the rough surface, achieving strong bonding without requiring additional groove formation steps, thus resolving the contradiction between bonding strength and manufacturing complexity
Solution Approach 2:
The invention extracts the groove formation step from the bonding process. Instead of forming grooves and filling adhesive separately, the rough surface itself serves as the embedding structure for the filler particles, simplifying the manufacturing process while maintaining bonding strength
2Quantity of substance
If gaps are provided in the bonding surface to reduce adhesive amount, then adhesive usage is reduced, but bonding strength may be compromised
Solution Approach 1:
By changing the surface roughness parameter to be higher than the filler grain size, the adhesive can be effectively utilized with reduced quantity. The rough surface creates natural embedding points for filler particles, allowing strong bonding with less adhesive material
3Strength
If surface roughness is increased to improve adhesive embedding, then bonding strength is improved, but manufacturing precision requirements increase
Solution Approach 1:
The invention specifies a clear parameter relationship (surface roughness > filler grain size) rather than requiring precise control of absolute roughness values. This approach improves bonding strength while avoiding excessive manufacturing precision requirements, as long as the roughness exceeds the known filler grain size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves stable and high bonding strength between the drum and planar cores, ensuring robustness against impacts and maintaining optimal inductance characteristics, even under different adhesive conditions.
Implementation Method 1
an adhesive containing an organic material and a filler for bonding the first substrate body and the second substrate body
Data Source
AI summary
A coil component includes: a first substrate body and a second substrate body, both formed in a manner containing a magnetic material; an adhesive containing an organic material and a filler, for bonding the first substrate body and the second substrate body; a coil formed by a conductor having an insulating film; and electrodes connected electrically to the coil; wherein the surface roughness of the face of the first substrate body bonded to the second substrate body via the adhesive is higher than the average grain size of the filler.