Coil Electronic Component Bottom Electrode Stray Capacitance
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Solution Overview
Problem
Inductors in electronic components face challenges in miniaturization and high-frequency applications due to stray capacitance between coil patterns and external electrodes, which degrades self-resonance frequency (SRF) and affects noise removal performance.
Innovation Solution
A multilayer coil electronic component design with first and second coil patterns forming turns in different directions, connected by conductive vias, and external electrodes placed on the bottom surface to minimize stray capacitance, utilizing a ferrite-based body for improved magnetic characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external electrodes are disposed on the bottom surface of the body, then stray capacitance between coil patterns and external electrodes is reduced, but electrical connection complexity increases
Solution Approach 1:
The patent transitions from conventional side-surface electrode placement to bottom-surface electrode placement, utilizing the third dimension (depth) to spatially separate electrodes from coil patterns. This dimensional repositioning reduces parasitic capacitance by increasing the distance between electrodes and coil patterns, thereby maintaining high self-resonance frequency characteristics.
Solution Approach 2:
The patent divides the electrical connection path into multiple segments: bottom electrodes connect to conductive vias, which then connect to coil patterns through intermediate conductive structures. This segmentation allows optimization of each segment independently, reducing overall parasitic effects while managing connection complexity.
2Reliability
If coil patterns are connected by conductive vias in a multilayer structure, then electrical connection is improved, but manufacturing complexity increases
Solution Approach 1:
The patent implements a nested multilayer structure where coil patterns, conductive vias, and magnetic layers are integrated in a compact stacked configuration. Each layer is nested within the overall structure, with conductive vias penetrating through magnetic layers to connect coil patterns across multiple levels, achieving high electrical connectivity within a miniaturized form factor.
Solution Approach 2:
The patent combines ferrite magnetic materials with conductive materials in a composite multilayer structure. The magnetic layers provide magnetic permeability for inductance, while conductive layers and vias provide electrical connectivity, creating a functionally integrated composite structure that simultaneously achieves magnetic and electrical performance.
3Volume of moving object
If the inductor is miniaturized, then device size is reduced, but stray capacitance increases causing SRF degradation
Solution Approach 1:
The patent addresses the SRF degradation issue in miniaturized inductors by repositioning electrodes to the bottom surface, utilizing vertical spacing rather than horizontal spacing to reduce parasitic capacitance. This allows compact planar dimensions while maintaining electrical performance through three-dimensional spatial arrangement.
Solution Approach 2:
The patent extracts the electrodes from the conventional side-surface location and relocates them to the bottom surface, separating the electrode function from the coil pattern plane. This extraction reduces the overlapping area between electrodes and coil patterns, thereby minimizing parasitic capacitance in the miniaturized structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively maintains high self-resonance frequency, enabling efficient high-frequency noise removal and improved electrical characteristics by reducing stray capacitance and optimizing the electrical connection path.
Implementation Method 1
The body may include a ferrite component
Data Source
AI summary
A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.