Coil Component Conductive Via Design for Plating Defect Prevention
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Solution Overview
Problem
The existing methods for manufacturing thin film type coil components often result in plating defects due to the exposure of insulating substrates during the formation of electrodes, leading to contact defects and other issues.
Innovation Solution
A coil component design where conductive vias penetrate through the support member to expose the terminals on the outer surface, preventing the insulating substrate from being exposed and thus avoiding plating defects, and a manufacturing method involving the formation of coils, conductive vias, and electrodes on a support member followed by embedding with a magnetic material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the insulating substrate is exposed to the outer surface of the magnetic body during electrode formation, then the manufacturing process is simplified, but plating defects and contact defects occur
Solution Approach 1:
The patent introduces a conductive via that penetrates through the support member in the vertical dimension, allowing the coil terminal to be electrically connected to the electrode on the outer surface without exposing the insulating substrate. This dimensional approach (creating a through-hole pathway) resolves the contradiction by providing an alternative routing path that avoids the plating defect issue while maintaining electrical connectivity.
Solution Approach 2:
The conductive via acts as an intermediary element that bridges the connection between the coil terminal and the electrode on the outer surface. Instead of directly exposing the insulating substrate for electrode formation, the conductive via serves as a mediating conductive path that enables electrical connection while keeping the insulating substrate hidden, thus preventing plating defects.
2Reliability
If the insulating substrate is covered by the support member, then plating defects are prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The support member is designed to serve multiple functions: it provides mechanical support for the coil, covers and protects the insulating substrate from exposure, and incorporates conductive vias for electrical connection. This multi-functionality reduces the need for separate protective structures, thereby simplifying the overall device complexity while maintaining reliability.
Solution Approach 2:
The patent merges the protective function (covering the insulating substrate) with the electrical connection function (providing conductive path) into a single integrated structure. The support member with embedded conductive vias combines both roles, eliminating the need for separate protective layers or additional connection structures, thus reducing device complexity.
3Reliability
If conductive vias are formed to penetrate the support member, then electrode formation reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive vias are formed in the support member before the coil is wound and before the final encapsulation. This preliminary action allows for better control of via placement and dimensions, ensuring proper alignment with the coil terminals and electrodes. By performing the via formation early in the process, manufacturing precision is managed more effectively while maintaining electrode formation reliability.
Data Source
AI summary
A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.