Coil Component Interlayer Connection via Direct Contact
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Solution Overview
Problem
Existing coil components face challenges in miniaturization and reliability, particularly with open failures during interlayer connections, which hinder the development of low-profile, high-aspect ratio inductors demanded by the miniaturization of IT devices.
Innovation Solution
A coil component design featuring a body with a first and second coil layer, where the first connection coil pattern is physically connected to the second coil layer without a via hole, using a thicker first connection coil pattern to prevent open failures and a thin second insulating layer to support the second coil layer, eliminating the need for laser drilling and reducing the risk of residue-induced failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a via hole is used to connect coil layers, then interlayer connection is achieved, but open failures occur during laser drilling process
Solution Approach 1:
The patent removes the via hole structure from the coil component design. Instead of drilling holes through insulating layers to connect coil layers, the invention uses direct physical contact between coil patterns at different layers, eliminating the laser drilling process and associated open failures
Solution Approach 2:
The patent introduces a thicker first connection coil pattern that extends upward to directly contact the second coil layer. This connection coil pattern acts as an intermediary structure that provides reliable electrical connection without requiring via holes through insulating layers
2Length of stationary object
If the coil component profile is reduced, then miniaturization is achieved, but manufacturing precision becomes more difficult
Solution Approach 1:
The patent transitions from vertical connection through insulating layers (via holes) to horizontal/surface connection where coil patterns directly contact each other. This dimensional change allows for lower profile while maintaining connection reliability through the thicker connection coil pattern
Data Source
AI summary
A coil component includes: a body; and external electrodes disposed on an external surface of the body. The coil part may include a first coil layer and a second coil layer connected to the first coil layer, each of the first and second coil layers may include a plurality of coil patterns, the plurality of coil patterns of the first coil layer may include a first connection coil pattern physically connected to the second coil layer, the plurality of coil patterns of the second coil layer may include a second connection coil pattern physically connected to the first connection coil pattern, and an upper surface of the first connection coil pattern may come into direct contact with a lower surface of the second connection coil pattern.