Coil Component Outer Electrode Plating
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Solution Overview
Problem
The existing coil components with magnetic body portions made from composite materials and embedded coil conductors face high manufacturing costs and inefficiencies due to thick silver films and high resistance in outer electrodes, as well as variations in electrical characteristics and plating thickness caused by impurities and delayed energization during the plating process.
Innovation Solution
A coil component design where the outer electrodes are electrically connected to both the coil conductor and the magnetic body portion, utilizing a second metallic material with lower specific resistance, and a method involving displacement plating and insulating film coating to form isolated conductive layers, reducing variations in thickness and electrical characteristics, and enabling efficient plating without the need for immediate energization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If outer electrodes are formed by applying silver paste containing thermosetting resin by dip coating, then outer electrodes can be formed on the magnetic body portion, but manufacturing costs are high because a thick film is formed by using silver
Solution Approach 1:
The patent changes the material parameter from silver paste to copper plating, fundamentally altering the composition and thickness characteristics of the outer electrode. This parameter change reduces material consumption while achieving the required electrical conductivity function.
Solution Approach 2:
The patent replaces expensive silver with cheaper copper material for the outer electrode formation. Although copper is less noble than silver, it provides sufficient electrical conductivity for the application, thereby reducing manufacturing costs and material consumption.
2Manufacturing precision
If outer electrodes are formed by applying silver paste containing thermosetting resin by dip coating, then outer electrodes can be formed on the magnetic body portion, but the resistance of each outer electrode is large because resin is present between the silver powder
Solution Approach 1:
The patent replaces the mechanical dip coating process with resin binder with an electrochemical plating process. The plating process deposits pure metal directly onto the surface without requiring organic binders, thereby eliminating the insulating resin layer and reducing electrical resistance.
Solution Approach 2:
The patent changes the formation mechanism from physical deposition with binder to electrochemical deposition, fundamentally altering the microstructure and electrical properties of the outer electrode by eliminating resin content.
3Ease of manufacture
If outer electrodes are formed by barrel plating, then outer electrodes can be formed on the magnetic body portion, but it is necessary to electrically connect the outer electrodes to each other and energize the outer electrodes at an early stage immediately after plating has been started
Solution Approach 1:
The patent introduces a preliminary conductive layer formation step before the main plating process. This preliminary layer provides immediate electrical connectivity, eliminating the need for complex real-time energization control during plating and simplifying the overall manufacturing process.
Solution Approach 2:
The patent introduces a conductive layer as an intermediary between the magnetic body portion and the outer electrodes. This intermediary layer facilitates early electrical connection and simplifies the plating process by providing a conductive base without requiring complex energization control.
4Device complexity
If outer electrodes are formed by barrel plating with delayed energization, then plating process can be simplified, but power supply from media may be hindered due to adhesion of impurities to the surface of the magnetic body portion
Solution Approach 1:
The patent performs preliminary surface treatment and conductive layer formation before plating to prevent impurity adhesion. This preliminary action ensures that the plating process can proceed without power supply hindrance, maintaining plating quality without complex energization control.
Solution Approach 2:
The patent applies preliminary surface preparation and conductive layer formation to counteract the potential harmful effect of impurity adhesion. By addressing the surface condition before plating, the patent prevents power supply hindrance and ensures consistent plating quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and variations in electrical characteristics and thickness of the outer electrodes, ensuring favorable electrical performance and efficient plating processes by establishing early electrical connections during the plating process.
Implementation Method 1
it is necessary to electrically connect the outer electrodes to each other and energize the outer electrodes at an early stage immediately after the plating has been started
Data Source
AI summary
A coil component includes a magnetic body portion that includes metallic particles and a resin material, a coil conductor that is embedded in the magnetic body portion, and a first outer electrode and a second outer electrode each of which is electrically connected to the coil conductor. At least a portion of an outer layer of the magnetic body portion forms an electrically conductive layer that includes a second metallic material having a specific resistance lower than a specific resistance of a first metallic material forming the metallic particles. The electrically conductive layer includes a first electrically conductive layer that is electrically connected to the first outer electrode and a second electrically conductive layer that is electrically connected to the second outer electrode. The first electrically conductive layer and the second electrically conductive layer are electrically isolated from each other.