Multi-Layer Coil Component Design for Inductance and Plating Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a demand for thinner, miniaturized chip type power inductors with high current and low DC resistance, but existing anisotropic plating technologies face challenges such as abnormal plating growth, plating thickness scattering, and shorts between coils due to increased aspect ratios, limiting coil width and number of turns.
Innovation Solution
A coil component design featuring a main substrate with alternating isotropic and anisotropic coil patterns embedded in a magnetic body, where the first and third coil patterns are formed using isotropic plating and the second and fourth patterns using anisotropic plating, connected via insulating layers to enhance inductance and prevent defects, while maintaining structural hardness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic plating technology is applied to increase aspect ratio of coil patterns, then inductance performance is improved in limited space, but manufacturing defects such as abnormal plating growth and short between coils are increased
Solution Approach 1:
The coil structure is segmented into multiple independent coil patterns (first, second, third, fourth coil patterns) arranged in a specific configuration. Each coil pattern is formed through separate plating processes, allowing independent control of plating parameters for each segment, thereby reducing the risk of abnormal growth and short circuits while maintaining high inductance performance.
Solution Approach 2:
Different plating methods are applied to different local regions: isotropic plating is used for the first and third coil patterns, while anisotropic plating is used for the second and fourth coil patterns. This local differentiation allows optimization of each region's plating quality according to its specific requirements, preventing uniform defects across the entire structure.
2Reliability
If aspect ratio of coil patterns is increased to achieve high performance in limited space, then inductance is improved, but coil width and number of turns are limited
Solution Approach 1:
The coil structure transitions from a single-plane configuration to a multi-dimensional arrangement with coil patterns distributed across different levels and orientations. The first and second coil patterns are arranged differently from the third and fourth patterns, utilizing three-dimensional space within the magnetic body to increase effective coil width and number of turns without increasing the footprint area.
3Reliability
If number of turns of coils is increased to secure core area, then capacitance is improved, but manufacturing complexity and defect risk are increased
Solution Approach 1:
The total number of turns is distributed across multiple segmented coil patterns rather than concentrated in a single complex coil. Each coil pattern contains a manageable number of turns that can be independently manufactured, reducing overall manufacturing complexity while achieving the required total capacitance through the combined effect of all patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves increased miniaturization and high capacitance while preventing defects like abnormal plating growth and shorts, allowing for improved inductance within a limited space without compromising the number of coil turns or core area.
Implementation Method 1
a magnetic body in which the first to fourth coil patterns are embedded
Implementation Method 2
a first insulating layer disposed on one surface of the first coil pattern... a second insulating layer disposed on one surface of the second coil pattern
Data Source
AI summary
A coil component includes a main substrate; a first coil pattern disposed on a first surface of the main substrate; a first insulating layer disposed on one surface of the first coil pattern; a third coil pattern disposed on one surface of the first insulating layer and electrically connected to the first coil pattern; a second coil pattern disposed on a second surface of the main substrate opposing the first surface; a second insulating layer disposed on one surface of the second coil pattern; a fourth coil pattern disposed on one surface of the second insulating layer and electrically connected to the second coil pattern; and a magnetic body in which the first to fourth coil patterns are embedded, and a board having the same.