Coil Component With Insulating Layer And Controlled Thickness
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Solution Overview
Problem
The miniaturization and thinning of coil components in electronic devices pose challenges in maintaining the same properties as conventional components, with anisotropic plating increasing the risk of defects such as non-uniform plating growth and short circuits, while requiring support members for rigidity to achieve high permeability and inductance.
Innovation Solution
A coil component design featuring a body with magnetic material, spiral-shaped coil pattern layers, an insulating layer, and external electrodes, where the insulating layer includes a magnetic film with an intermetallic compound, and the coil pattern layers have a controlled thickness-to-width ratio, allowing for reduced DC resistance and increased inductance without the need for anisotropic plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic plating is applied to increase the aspect ratio of coil pattern, then the cross section of coil is increased and inductance is improved, but the uniformity of plating growth deteriorates and short circuits between coils occur
Solution Approach 1:
The patent changes the geometric parameters of the coil pattern, specifically controlling the thickness-to-width ratio to be less than or equal to 1, which differs from conventional high aspect ratio designs. This parameter change allows achieving desired inductance without relying on anisotropic plating, thus avoiding plating uniformity issues while maintaining reliable electrical performance
Solution Approach 2:
The patent extracts and eliminates the need for anisotropic plating process from the manufacturing methodology. By redesigning the coil geometry with controlled thickness-to-width ratio, the invention removes the dependency on complex plating techniques that cause manufacturing defects, simplifying the process and improving reliability
2Strength
If support members with certain thickness are used to maintain rigidity for anisotropic plating, then the structural stability is improved, but the thickness of magnetic material covering the coil is reduced and inductance decreases
Solution Approach 1:
The patent changes the geometric parameters of the coil pattern, specifically controlling the thickness-to-width ratio to be less than or equal to 1, which differs from conventional high aspect ratio designs. This parameter change allows achieving desired inductance without relying on anisotropic plating, thus avoiding plating uniformity issues while maintaining reliable electrical performance
Solution Approach 2:
The patent employs composite structure combining coil pattern layers with magnetic material covering layer. This composite design allows optimizing the magnetic material thickness independently of the support member rigidity requirements, as the controlled coil geometry compensates for the reduced magnetic material thickness, maintaining high inductance
3Volume of moving object
If the size of coil component is reduced for miniaturization, then the device thickness is decreased, but maintaining the same properties as conventional coil components becomes difficult
Solution Approach 1:
The patent changes the geometric parameters of the coil pattern, specifically controlling the thickness-to-width ratio to be less than or equal to 1, which differs from conventional high aspect ratio designs. This parameter change allows achieving desired inductance without relying on anisotropic plating, thus avoiding plating uniformity issues while maintaining reliable electrical performance
Solution Approach 2:
The patent transitions from relying on vertical height (aspect ratio) to achieve inductance to using controlled thickness-to-width ratio in a more balanced dimensional approach. This dimensional shift allows miniaturization while maintaining electrical properties through optimized geometry rather than extreme aspect ratios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the uniformity and reliability of coil components by reducing the risk of defects and achieving high inductance while maintaining low DC resistance, without the limitations of anisotropic plating, thus supporting the miniaturization and thinning of electronic devices.
Implementation Method 1
The magnetic film may include an insulating resin and a magnetic filler.
Implementation Method 2
coil pattern layers encased by the magnetic material, a core portion surrounded by the coil pattern layers
Implementation Method 3
The via hole may include an intermetallic compound (IMC).
Data Source
AI summary
A coil component includes: a body including a magnetic material, coil pattern layers disposed in the magnetic material, a core portion surrounded by the coil pattern layers, and an insulating layer disposed in the core portion and between adjacent coil pattern layers among the coil pattern layers, wherein each of the coil pattern layers comprises a spiral-shaped pattern; and an external electrode disposed on the body.