Coil Component Insulating Layer Segmentation
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Solution Overview
Problem
Existing miniaturized inductors face challenges in achieving high electrical characteristics and reliability due to limitations in coil pattern design, particularly in maintaining a fine line width and preventing issues like leaning, warpage, or delamination of insulating layers, which can lead to short-circuit defects.
Innovation Solution
A coil component design featuring a support member with through-holes and insulating layers, where the first insulating layer is used to guide plating growth and the second insulating layer stabilizes the first layer, reducing the risk of delamination and enhancing the aspect ratio of the coil pattern, with external electrodes and a magnetic material encapsulating the coil pattern to improve magnetic flux and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the coil pattern line width is reduced to achieve miniaturization, then the inductor size is reduced, but the electrical characteristics and reliability deteriorate due to manufacturing difficulties
Solution Approach 1:
The insulating layer is divided into multiple segments (first insulating layer 122 and second insulating layer 123) with different functions. The first insulating layer guides plating growth to achieve fine line width, while the second insulating layer provides mechanical support and prevents delamination, thereby enabling miniaturization without compromising reliability
Solution Approach 2:
The first insulating layer acts as an intermediary between the coil pattern and the second insulating layer. It provides a controlled interface that guides plating growth for fine line width while the second insulating layer serves as a mediator providing mechanical support, thus resolving the conflict between miniaturization and manufacturing reliability
2Length of stationary object
If the insulating layer thickness is reduced to achieve thinner inductor profile, then the inductor thickness is reduced, but the insulating layer becomes prone to leaning, warpage, and delamination
Solution Approach 1:
The insulating layer structure is segmented into two distinct layers: the first insulating layer (thickness 5-20 μm) that is thin enough to enable miniaturization but sufficient to guide plating growth, and the second insulating layer (thickness 10-30 μm) that provides mechanical support to prevent leaning and warpage, thus resolving the thickness-stability contradiction
Solution Approach 2:
Different regions of the insulating structure have different thicknesses and properties. The first insulating layer has optimized thickness for plating guidance, while the second insulating layer has greater thickness for mechanical stability, allowing each layer to perform its specific function optimally without compromising overall structure
3Reliability
If the coil pattern aspect ratio is increased to achieve higher inductance, then the inductance value is improved, but the manufacturing precision deteriorates due to difficulty in maintaining fine line width
Solution Approach 1:
The first insulating layer is formed beforehand to provide a controlled surface for plating growth. This preliminary structure ensures that even when achieving high aspect ratios for high inductance, the coil pattern maintains precise line width control throughout the manufacturing process
Solution Approach 2:
The first insulating layer serves as an intermediary that mediates between the plating process and the final coil pattern. It provides a controlled interface that ensures uniform plating deposition, enabling high aspect ratio coil patterns to be manufactured with precise line width control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively increases the aspect ratio of the coil pattern, enhances electrical characteristics, and improves reliability by stabilizing the insulating layers and preventing short-circuit defects, while maintaining a compact form factor.
Implementation Method 1
the first insulating layer is used to guide plating growth
Implementation Method 2
a magnetic material encapsulating the coil pattern to improve magnetic flux and electrical connectivity
Data Source
AI summary
A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.