Coil Component Manufacturing via Layer Merging

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Solution Overview

Problem

Conventional methods for manufacturing coil components require increased labor due to the need for multiple steps in preparing green sheets, which complicates the process and does not effectively reduce electrical resistance.

Innovation Solution

A method involving the formation of unbaked coil wiring and extended wiring layers in the same layer on a sheet-like magnetic layer, allowing for increased thickness of coil wiring layers to reduce electrical resistance while simplifying the manufacturing process by eliminating the need for additional magnetic layers in the extended wiring zone.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the conventional method of applying conductive paste and insulator paste iteratively on green sheets is used, then the thickness of the coil wiring layer can be increased to reduce electrical resistance, but the number of manufacturing steps and labor increase

Engineering Contradiction:
Improvethickness of coil wiring layerVSAvoidnumber of manufacturing steps
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the coil wiring layer and magnetic layer into a single integrated structure by forming both layers simultaneously in the same unbaked state, then baking them together. This eliminates the need for separate green sheet preparation steps for each layer, reducing the total number of manufacturing steps while maintaining the required thickness of the coil wiring layer for low electrical resistance

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The unbaked magnetic layer serves dual functions: it acts as both the magnetic layer and the support substrate (replacing the traditional green sheet) for subsequent coil wiring layer formation. This multi-functionality eliminates the need for separate green sheets, simplifying the manufacturing process while enabling thicker coil wiring layers

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If green sheets are prepared for each layer in the conventional method, then the coil wiring layer can be formed with sufficient thickness, but the preparation steps and labor increase

Engineering Contradiction:
Improvethickness control of coil wiring layerVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges the preparation of the magnetic layer and coil wiring layer into a single simultaneous process where both are formed in the unbaked state on the same substrate, then baked together in one step. This maintains precise thickness control of the coil wiring layer while dramatically improving manufacturing efficiency by eliminating repetitive green sheet preparation

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The magnetic layer is formed in the unbaked state first, creating a preliminary substrate that supports subsequent coil wiring layer formation. This preliminary action allows the coil wiring layer to be formed with sufficient thickness without requiring separate green sheets, thereby improving productivity while maintaining manufacturing precision

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20230238171A1Method of manufacturing coil component
Publication Date: 2023.07.27 MURATA MFG CO LTD
  • US20230238171A1 patent drawing
  • US20230238171A1 patent drawing
  • US20230238171A1 patent drawing

AI summary

A method of manufacturing a coil component which includes an element body including magnetic layers stacked in a first direction and having a surface located in the first direction or a second direction reverse to the first direction, a coil and extended wiring in the element body, and an outer electrode at least on the surface. The method includes forming an unbaked coil wiring layer zone by providing a paste-like unbaked coil wiring layer and a paste-like unbaked magnetic layer in the same layer in the direction orthogonal to the first direction on an upper surface of a sheet-like unbaked magnetic layer with respect to the first direction; and forming an unbaked extended wiring layer zone by providing a paste-like unbaked extended wiring layer and a paste-like unbaked magnetic layer in the same layer in the direction orthogonal to the first direction without providing a sheet-like unbaked magnetic layer.