Coil Electronic Component with Enlarged Lead Clearance
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Solution Overview
Problem
Thin film type inductors face challenges in maintaining high performance and reliability due to the increasing slimness of coil electronic components, leading to a higher likelihood of short circuits between the coil pattern and the lead portion during manufacturing processes.
Innovation Solution
The distance between the lead portion and the adjacent coil pattern is increased, with the lead portion being designed with a larger distance than the pitch of the coil pattern, and a curved or inclined surface to prevent short circuits, while maintaining electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the distance between the coil pattern and lead portion is reduced to achieve component slimness, then the component thickness is decreased, but the reliability deteriorates due to higher short circuit risk
Solution Approach 1:
The patent applies local quality by differentiating the spacing between adjacent coil patterns from the spacing between the coil pattern and lead portion. Specifically, the distance between the coil pattern and lead portion is set to be greater than the pitch of the coil pattern, creating a localized enlarged clearance at the critical interface where short circuits are most likely to occur during plating processes.
2Reliability
If the distance between the coil pattern and lead portion is increased to prevent short circuits, then the reliability is improved, but the component thickness increases
Solution Approach 1:
The patent applies parameter changes by optimizing the dimensional parameter of the distance between the coil pattern and lead portion. The distance is specifically designed to be greater than the pitch of the coil pattern but controlled to minimize the overall component thickness, achieving a balance between reliability improvement and maintaining slim component profile.
3Length of stationary object
If the component is made thinner to meet slimness requirements, then the component thickness is decreased, but the manufacturing precision deteriorates due to higher short circuit risk
Solution Approach 1:
The patent applies preliminary action by pre-establishing an adequate distance between the coil pattern and lead portion before the plating process occurs. This preventive design ensures that even if excessive growth occurs during plating, the pre-established clearance prevents short circuits, thereby maintaining manufacturing precision without compromising component slimness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the possibility of short circuits, enhancing the reliability and achieving high inductance of the coil electronic component.
Implementation Method 1
a body region filling at least a core region of the coil pattern and having a magnetic material
Data Source
AI summary
A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a lead portion forming a portion of an outermost region of the coil pattern and exposed to the outside of the body region. A distance between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance between adjacent patterns of the coil pattern.