Coil Component Lead-Out Conductor Overlap for Photolithography
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Solution Overview
Problem
Conventional coil components face issues with thinning or disconnection of coil conductor layers due to reduced size and height, leading to inadequate exposure during photolithography, which affects the manufacturing of second coil conductor layers.
Innovation Solution
The coil component design includes a first coil conductor layer with a lead-out conductor having a coil extension part that overlaps with the second coil conductor layer, and optionally dummy conductor layers, to improve exposure and reduce thinning or disconnection during photolithography.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size and height of the coil component are reduced, then the compactness is improved, but the exposure quality during photolithography deteriorates due to insufficient light reaching the lower layers
Solution Approach 1:
The patent introduces a new spatial arrangement by making the lead-out conductor extend in the lamination direction (vertical dimension) to overlap with the second coil conductor layer, rather than only extending in the planar direction. This dimensional change allows the lead-out conductor to reach the lower layer where photolithography exposure is insufficient, thereby solving the exposure quality problem while maintaining reduced component size.
Solution Approach 2:
The lead-out conductor serves as an intermediary structure that bridges the first and second coil conductor layers. By extending this conductor vertically through the insulating layer, it provides a physical pathway for light to reach the lower layer during photolithography, mediating between the lighting system and the deeply embedded second coil conductor layer.
2Length of stationary object
If the wiring interval and distance between coil conductor layers are reduced, then the compactness is improved, but the exposure light from lower layers becomes significant causing thinning or disconnection
Solution Approach 1:
The lead-out conductor is designed to extend in advance toward the second coil conductor layer before the photolithography process completes. This preliminary positioning of the lead-out conductor creates a light pathway that prevents insufficient exposure from occurring, thereby preventing thinning or disconnection of the second coil conductor layer before the manufacturing process finishes.
Solution Approach 2:
The patent applies different structural configurations to different regions: the lead-out conductor is made to extend vertically in specific locations where light pathway is needed, while maintaining the compact layered structure in other regions. This localized modification ensures reliable exposure only where necessary, preventing thinning or disconnection at critical interfaces without compromising overall compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the occurrence of thinning or disconnection in the second coil conductor layer by ensuring proper overlap and exposure, allowing for consistent manufacturing even at reduced sizes and heights.
Implementation Method 1
when the second coil conductor layer is manufactured by photolithography
Data Source
AI summary
A coil component comprising a first coil conductor layer wound on a plane, a lead-out conductor led out on the same plane as the first coil conductor layer from an outer-circumferential end of the first coil conductor layer, an insulating layer laminated on the first coil conductor layer and the lead-out conductor, and a second coil conductor layer laminated on the insulating layer and wound on a plane. The first coil conductor layer and the second coil conductor layer concentrically overlap with each other when viewed in a lamination direction, and the lead-out conductor has a connecting portion connected to the first coil conductor layer and provided with a coil extension part extending to overlap with the second coil conductor layer when viewed in the lamination direction.