Coil Component Lead-Out Pattern Thickness for Bonding Reliability
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Solution Overview
Problem
As coil components become thinner, the bonding area between the end portion of the coil and the external electrode decreases, leading to reliability issues in their bonding.
Innovation Solution
A coil component design with an insulating substrate and a coil pattern layer, where the lead-out patterns are exposed and have a thicker thickness than the coil patterns, allowing for increased contact area and bonding force with external electrodes, while maintaining a low profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If coil components become thinner, then the size of the coil component is reduced, but the bonding area between the lead-out pattern and external electrode decreases
Solution Approach 1:
The patent applies local quality by making the lead-out pattern have a greater thickness than the coil pattern. This localized thickness increase at the bonding region provides a larger bonding area and improved mechanical strength where needed, while keeping the overall component thin. The lead-out pattern's enhanced thickness specifically addresses the bonding interface without increasing the total component size.
Solution Approach 2:
The patent utilizes the thickness dimension (z-direction) to resolve the contradiction. By increasing the thickness of the lead-out pattern in the vertical dimension rather than expanding the planar bonding area, the invention achieves better bonding reliability without increasing the footprint or overall size of the coil component in the x-y plane.
2Reliability
If the lead-out pattern is made thicker, then the bonding area with external electrode increases, but the overall profile height increases
Solution Approach 1:
The patent carefully controls the thickness parameter of the lead-out pattern to be greater than the coil pattern thickness but less than the insulating layer thickness. This parameter optimization ensures adequate bonding area while maintaining a low overall profile, as the insulating layer caps the maximum height and prevents excessive profile increase.
Solution Approach 2:
The thickness increase is localized only to the lead-out pattern region, not the entire coil component. This localized modification provides the necessary bonding area enhancement without proportionally increasing the overall profile height, as other regions (coil patterns, insulating layers) maintain their original dimensions.
Data Source
AI summary
A coil component includes a body having one surface and the other surface facing each other; an insulating substrate embedded in the body, and having one surface substantially perpendicular to the one surface of the body; a coil portion disposed on the one surface of the insulating substrate, and including a coil pattern layer having a coil pattern and a lead-out pattern extending from the coil pattern and exposed from the one surface of the body; an insulating layer disposed on the one surface of the insulating substrate to cover the coil pattern layer; and first and second external electrodes arranged to be spaced apart from each other on the one surface of the body and respectively connected to the lead-out pattern. A thickness of the lead-out pattern is greater than a thickness of the coil pattern, and less than a thickness of the insulating layer.