Coil Electronic Component Lead-Out Pattern Thickness Direction
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Solution Overview
Problem
Existing coil electronic components face challenges in reducing size while maintaining performance and structural stability, particularly in increasing magnetic material content and minimizing warpage of support substrates.
Innovation Solution
The design incorporates a support substrate with a coil pattern, a lead-out pattern extending in the thickness direction, and protrusions on the coil pattern, which are integrated and encapsulated, along with external electrodes, to enhance cohesion and reduce warpage, thereby improving structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the coil electronic component is reduced, then the component meets miniaturization demands, but the cohesion force between external electrode and lead-out pattern deteriorates and warpage increases
Solution Approach 1:
The lead-out pattern extends in the thickness direction (vertical dimension) of the support substrate rather than only in the horizontal plane. This three-dimensional configuration increases the bonding area between the lead-out pattern and external electrode, improving cohesion force while maintaining a compact footprint that meets miniaturization requirements.
Solution Approach 2:
The lead-out pattern is divided into multiple segments including a first lead-out pattern on the front surface, a second lead-out pattern on the rear surface, and protrusions extending between them. This segmentation allows the bonding function to be distributed across multiple surfaces and regions, enhancing overall adhesion while reducing stress concentration that could cause warpage.
2Quantity of substance
If magnetic material content is increased to maintain performance after size reduction, then inductance properties are preserved, but strength of the inductor body and frequency properties deteriorate due to insulating property limitations
Solution Approach 1:
The support substrate has different properties in different regions: a first region with high magnetic permeability for inductance function, and a second region with high mechanical strength for structural support. This local differentiation allows the substrate to simultaneously provide both magnetic functionality and mechanical strength without requiring uniform increase in magnetic material content throughout the entire component.
Data Source
AI summary
A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, and a lead-out pattern disposed on at least one surface of the support substrate and connected to the coil pattern. An encapsulant encapsulates at least portions of the support substrate, the coil pattern, and the lead-out pattern, and at least one protrusion protrudes from one side surface of the coil pattern. External electrodes are disposed externally on the encapsulant and connected to the lead-out pattern. The lead-out pattern is configured to extend in a thickness direction of the support substrate and to cover a side surface of the support substrate.