Coil Component Magnetic Layer Plating for Inductance
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Solution Overview
Problem
Miniaturization of chip electronic components, such as thin layer inductors, has led to decreased inductance and quality factor due to reduced volume and number of coil turns, making it difficult to achieve target inductance and quality factor while maintaining high permeability.
Innovation Solution
A coil electronic component with a magnetic body and a high permeability magnetic layer formed on its surfaces, using a plating process, which includes a metallic layer of iron, silicon, or other metals, and an insulating cover layer to prevent short-circuit defects and flux loss, while the coil part is embedded within the magnetic body and lead parts extend to the surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of chip electronic components is miniaturized, then the volume and number of coil turns are reduced, but the inductance and quality factor decrease
Solution Approach 1:
The patent applies local quality by forming a magnetic layer with high permeability specifically on the surface of the magnetic body, rather than requiring the entire component to be large. This localized enhancement of magnetic properties at the surface compensates for the reduced volume, maintaining inductance and quality factor despite miniaturization.
Solution Approach 2:
The patent uses composite materials by combining the magnetic body (made of magnetic powder and resin) with a separate magnetic layer formed by plating. This composite structure allows the core to be small while the surface layer provides enhanced magnetic permeability, resolving the contradiction between miniaturization and maintaining electromagnetic performance.
2Reliability
If the permeability of magnetic material is increased to maintain inductance, then the manufacturing complexity increases
Solution Approach 1:
The patent segments the magnetic structure into two parts: the magnetic body (core) and the magnetic layer formed on its surface. This segmentation allows the bulk material to remain simple (magnetic powder + resin) while the surface layer provides the necessary high permeability, simplifying manufacturing compared to requiring the entire component to be made of high-permeability material.
Solution Approach 2:
The patent changes the permeability parameter locally by adding a magnetic layer on the surface, rather than changing the permeability of the entire magnetic body. This parameter change approach maintains inductance while keeping the manufacturing process simple, as the magnetic layer can be formed by standard plating processes.
3Reliability
If a magnetic layer is formed on the surface of the magnetic body, then the permeability and inductance increase, but the manufacturing process becomes more complex
Solution Approach 1:
The patent uses a plating seed layer as an intermediary between the magnetic body and the magnetic layer. This seed layer facilitates the plating process by providing a conductive base, making the formation of the magnetic layer easier and more controllable, thus reducing manufacturing complexity while achieving the desired permeability enhancement.
4Volume of moving object
If the number of coil turns is reduced due to miniaturization, then the component size decreases, but the inductance decreases
Solution Approach 1:
The patent compensates for the reduced number of coil turns by enhancing the magnetic properties locally through the magnetic layer on the surface. This localized improvement in permeability increases the inductance despite fewer turns, allowing miniaturization without sacrificing electromagnetic performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the permeability and inductance of the coil electronic component without increasing the magnetic material's permeability, enhancing the quality factor and preventing magnetic flux loss, thus addressing the limitations of miniaturization.
Implementation Method 1
The magnetic layer may be formed by a plating process
Implementation Method 2
a magnetic body comprising a magnetic material; a coil part embedded in the magnetic body
Data Source
AI summary
A coil electronic component includes: a magnetic body comprising a magnetic material; a coil part embedded inside the magnetic body; and a magnetic layer disposed on a surface of the magnetic body.


