Coil Component Manufacturing Inner Magnetic Path Cross-Section
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Solution Overview
Problem
Conventional coil component manufacturing methods result in a small cross-sectional area of the inner magnetic path, making it difficult to achieve high inductance values due to position tolerance issues between the hole part and spiral wirings.
Innovation Solution
A method involving the use of dummy metal layers, sacrificial conductors, and plating to increase the cross-sectional area of the inner magnetic path by forming spiral wirings and sacrificial conductors simultaneously, followed by etching to create the hole part, allowing for higher inductance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If spiral wirings and hole part are formed separately with photolithography, then manufacturing process is simple, but position tolerance accumulates and cross-sectional area of inner magnetic path becomes small
Solution Approach 1:
The patent merges the formation of spiral wirings and sacrificial conductors into a single plating step. Both structures are formed simultaneously from the same metal layer, eliminating the need for separate photolithography processes. This merging eliminates cumulative position tolerance and ensures precise relative positioning between the spiral wirings and the hole part, thereby maximizing the cross-sectional area of the inner magnetic path.
Solution Approach 2:
The patent introduces a sacrificial conductor as an intermediary structure. This sacrificial conductor is formed simultaneously with the spiral wirings through plating, then removed to create the hole part. The intermediary approach allows the hole part to be precisely positioned relative to the spiral wirings without requiring separate positioning steps, thus improving manufacturing precision while managing process complexity.
2Manufacturing precision
If position tolerance is reduced to increase cross-sectional area, then inductance value increases, but manufacturing precision requirements become stricter
Solution Approach 1:
By merging the formation of spiral wirings and sacrificial conductors into a single plating operation, the patent inherently reduces position tolerance between these structures. Since both are formed from the same metal layer in the same process step, their relative positions are determined by the plating process itself rather than by multiple separate positioning steps. This automatically achieves high manufacturing precision without requiring stricter external controls, thereby reliably increasing the cross-sectional area and inductance value.
3Ease of manufacture
If spiral wiring and sacrificial conductor are formed at different steps, then process flexibility is maintained, but position tolerance accumulates
Solution Approach 1:
The patent combines the formation of spiral wirings and sacrificial conductors into a single plating step, eliminating cumulative position tolerance. The process maintains flexibility because the sacrificial conductor can still be selectively removed in subsequent steps to form the hole part. By merging the formation steps while separating the removal steps, the patent achieves both high manufacturing precision and adequate process flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively increases the cross-sectional area of the inner magnetic path and achieves higher inductance values by reducing position tolerance and allowing for easier formation of the hole part, while also preventing delamination and improving processing accuracy.
Implementation Method 1
enlarging the first sacrificial conductor connected to the dummy metal layer by plating by energizing the dummy metal layer
Implementation Method 2
enlarging the first spiral wiring by plating by directly or indirectly energizing the first spiral wiring
Data Source
AI summary
A method of manufacturing a coil component includes the steps of disposing a dummy metal layer on a base; laminating a base insulating resin on the dummy metal layer; exposing the dummy metal layer by disposing an opening part in the base insulating resin; disposing a spiral wiring on the base insulating resin and disposing a sacrificial conductor on the dummy metal layer in the opening part of the base insulating resin; enlarging the sacrificial conductor by plating by energizing the dummy metal layer; covering the spiral wiring and the sacrificial conductor with an insulating resin; exposing the sacrificial conductor by disposing an opening part in the insulating resin; forming a hole part by removing the sacrificial conductor by etching from the opening part of the insulating resin; and constructing the inner magnetic path of a magnetic resin by filling the hole part with the magnetic resin.