Coil Component Planar Winding for Low DC Resistance
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Solution Overview
Problem
The miniaturization and thinning of coil components in electronic devices pose a challenge in maintaining existing characteristics, particularly in achieving low direct current resistance (Rdc) and high inductance (Ls) due to the limitations of existing manufacturing methods that often result in reduced inductance and design constraints from nonmagnetic support members.
Innovation Solution
A coil component design featuring a body with a reduced volume of insulating material and an increased volume of magnetic material, utilizing a structure with a first coil pattern on one surface and a second coil pattern with an embedded pattern inside the insulating layer, which allows for improved inductance characteristics without a support member, and a manufacturing method involving photolithography and plating processes to form the coil patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the volume of magnetic material is increased to improve inductance characteristics, then the inductance increases, but the overall component volume increases
Solution Approach 1:
By forming coil patterns on both surfaces of the insulating layer rather than stacking layers vertically, the patent achieves increased inductance through horizontal/planar expansion in the length and width dimensions rather than vertical thickness increase. This allows improved inductance characteristics while maintaining miniaturization and thinning of the overall component volume
2Volume of moving object
If existing manufacturing methods are used for miniaturized coil components, then the component size is reduced, but the inductance characteristics deteriorate
Solution Approach 1:
The patent divides the coil structure into multiple segments: first coil pattern on the front surface, second coil pattern on the back surface, with each having specific winding directions. This segmentation allows optimized inductance characteristics in each layer while maintaining compact overall dimensions, resolving the contradiction between miniaturization and inductance preservation
Solution Approach 2:
The patent utilizes the third dimension (thickness direction) by forming coil patterns on both front and back surfaces of the insulating layer. This approach enables increased effective winding area and improved inductance characteristics while keeping the component footprint small, thereby achieving miniaturization without sacrificing inductance performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves low direct current resistance and enhanced inductance by minimizing the thickness of the insulating material between coil patterns, allowing for more compact and efficient coil components with increased design freedom.
Implementation Method 1
a first coil pattern (41) disposed on one surface of the insulating layer (20), and a second coil pattern (42) disposed on the other surface of the insulating layer (20)
Implementation Method 2
a manufacturing method involving photolithography and plating processes to form the coil patterns
Data Source
AI summary
A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.