Coil Component Manufacturing via Differential Plating Thickness
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Solution Overview
Problem
Existing thin film inductors face challenges in increasing binding force between the body and the coil part, particularly in achieving a thinner lead pattern thickness to enhance multifunctionality and reduce thickness while maintaining performance.
Innovation Solution
A manufacturing method involving the formation of a plating resist with specific opening and hollow patterns, allowing for the creation of a lead pattern with a thickness smaller than the coil pattern, which is then connected and integrated into the coil component, improving the binding force and magnetic material distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the lead pattern is formed with the same thickness as the coil pattern, then the manufacturing process is simple, but the binding force between the body and coil part is insufficient
Solution Approach 1:
The patent applies local quality by forming the lead pattern with a different thickness (smaller thickness) compared to the coil pattern in specific regions. This localized thickness variation enhances the binding force between the body and coil part where needed, without complicating the entire manufacturing process. The plating resist is selectively removed or not formed in certain areas to achieve this local thickness difference.
2Length of stationary object
If the lead pattern thickness is reduced to enhance multifunctionality and reduce overall thickness, then the coil component becomes thinner and more versatile, but the manufacturing precision required increases
Solution Approach 1:
The patent uses the plating resist as an intermediary tool to achieve precise thickness control of the lead pattern. By selectively forming or removing the plating resist in specific regions, the manufacturing process can precisely control the lead pattern thickness without requiring direct precision control during the plating process itself. This intermediary approach enables thin lead patterns while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the binding force between the coil part and the body, increasing the quality factor of the coil component and allowing for a more efficient magnetic field generation, while also reducing the overall thickness and manufacturing costs.
Implementation Method 1
forming a coil pattern and a lead pattern connected to the coil pattern and at least partially having a thickness smaller than that of the coil pattern by plating
Data Source
AI summary
A manufacturing method of a coil component includes: forming a plating resist on an internal insulating layer; forming a coil pattern and a lead pattern connected to the coil pattern and at least partially having a thickness smaller than that of the coil pattern by plating; removing the plating resist; and stacking a magnetic sheet on the internal insulating layer to form a body.