Coil Component Protruding Insulating Layer Solder Flow Control
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Solution Overview
Problem
High density mounting of surface-mount type coil components with alternately stacked conductor and interlayer insulating layers can lead to short-circuit failures due to unintended solder flow.
Innovation Solution
The coil component design includes protruding interlayer insulating layers between electrode patterns, recessed electrode surfaces, and optional conductive paste coverage, which controls solder flow and prevents short-circuits by creating a level difference that suppresses solder spread onto magnetic layers, while maintaining manufacturing cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high density mounting is performed with conventional coil components, then mounting density is improved, but short-circuit failure occurs due to unintended solder flow
Solution Approach 1:
The patent applies dimensionality change by making the interlayer insulating layer protrude from the surface of the electrode pattern in the stacking direction. This creates a three-dimensional structure where the insulating layer extends beyond the electrode surface, forming a physical barrier that prevents solder from flowing upward onto adjacent magnetic layers during high-density mounting, thus resolving the contradiction between mounting density and short-circuit prevention
Solution Approach 2:
The protruding interlayer insulating layer acts as an intermediary barrier between the electrode pattern and the magnetic layer. This intermediate structure prevents direct contact between solder and the magnetic layer surface, eliminating the short-circuit path while allowing high-density mounting to proceed safely
2Reliability
If the interlayer insulating layer protrudes from the electrode pattern surface, then solder flow control is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the interlayer insulating layer with the coil component structure itself, making the insulating layer an integral part of the stacked configuration. The insulating layer serves dual purposes: electrical insulation between conductor layers and physical barrier against solder flow, thereby improving solder flow control without requiring separate protective structures or complex manufacturing processes
3Reliability
If the electrode pattern surface is recessed from the magnetic layer surface, then solder short-circuit prevention is improved, but solder contact area decreases
Solution Approach 1:
The patent resolves this contradiction by utilizing the stacking direction (vertical dimension) rather than reducing the horizontal electrode pattern area. The interlayer insulating layer protrudes upward from the electrode surface, creating a vertical barrier that prevents solder from reaching the magnetic layer while the electrode pattern maintains its full horizontal surface area for solder contact, thus achieving both short-circuit prevention and adequate solder contact
Data Source
AI summary
To prevent a short-circuit failure by controlling the flow of a solder in a surface-mount type coil component. A coil component includes a coil part in which conductor layers and interlayer insulating layers are alternately stacked. The conductor layers respectively have coil conductor patterns embedded in the coil part and electrode patterns exposed from the coil part. The interlayer insulating layers each protrude from the plurality of electrode patterns at a part between the electrode patterns, and the flow of a solder in the stacking direction is suppressed by the protruding parts. This makes it possible to prevent a short-circuit failure due to the flow of a solder in the stacking direction.