Coil Component Rdc Adjustment via Segmented Connection Patterns
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Solution Overview
Problem
Current methods for manufacturing thin film power inductors with small sizes face challenges in finely adjusting the Rdc characteristic, making it difficult to achieve desired performance.
Innovation Solution
The coil component design includes a substrate with coil patterns, lead-out portions, and connection portions featuring connection patterns and separation patterns, allowing for precise adjustment of the Rdc value by removing conductors after copper plating, thereby altering the current path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the thickness of copper plating is adjusted to achieve desired Rdc characteristic in a thin film type power inductor, then the Rdc value can be modified, but it is difficult to finely adjust the Rdc value
Solution Approach 1:
The connection portion is divided into multiple connection patterns that can be selectively removed. Instead of adjusting the entire copper plating thickness, the patent segments the connection path into discrete patterns (first, second, third connection patterns) that can be individually eliminated through laser processing. This segmentation enables fine-grained control of Rdc by removing specific patterns rather than uniformly changing plating thickness across the entire component.
Solution Approach 2:
The patent changes the parameter being adjusted from copper plating thickness to the number and configuration of connection patterns. By varying which connection patterns are present or removed, the effective resistance path is modified. This parameter change approach allows continuous fine adjustment of Rdc values by selectively removing patterns, providing more granular control compared to discrete plating thickness adjustments.
2Volume of moving object
If the coil component size is reduced to meet miniaturization requirements, then the component fits better in electronic devices, but the ability to adjust Rdc characteristic is limited
Solution Approach 1:
The patent transitions from adjusting Rdc through a single dimension (copper plating thickness) to multiple dimensions by introducing the connection pattern configuration space. The connection portion can be configured with different numbers and arrangements of connection patterns, creating additional degrees of freedom for Rdc adjustment. This dimensional expansion allows fine Rdc tuning even in miniaturized components where plating thickness adjustment range is limited.
Solution Approach 2:
The patent introduces dynamic adjustability to the connection portion by making the connection patterns selectively removable. The connection structure transitions from a fixed, static configuration to a dynamic one where patterns can be removed based on desired Rdc specifications. This dynamic capability allows the same base design to be adapted to different Rdc requirements without changing the overall component size, maintaining miniaturization while preserving adjustment flexibility.
Data Source
AI summary
A coil component includes: a body; a substrate disposed in the body, and having a first surface and a second surface facing each other; a coil unit including first and second coil patterns disposed on the first surface and the second surface of the substrate, respectively, first and second lead-out portions extending to surfaces of the body, a first connection portion disposed between the first coil pattern and the first lead-out portion, and a second connection portion disposed between the second coil pattern and the second lead-out portion; and first and second external electrodes disposed to be spaced apart from each other on the body and connected to the first and second lead-out portions, respectively. Each of the first and second connection portions includes one connection pattern and at least one separation pattern. The connection pattern has a smaller line width than a respective one of the lead-out portions.