Coil Electronic Component With Shared Magnetic Core
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Solution Overview
Problem
The challenge is to increase the coupling coefficient between coils in inductor arrays while maintaining a small size and efficiency, as existing technologies face limitations in reducing the interval between coils without compromising performance.
Innovation Solution
A coil electronic component design featuring a first and second coil sharing a magnetic core, with a main board between them, and insulating layers to enhance magnetic permeability and coupling, allowing for increased mutual inductance and coupling coefficient without increasing the mounted area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the interval between coils is decreased to increase the coupling coefficient, then the coupling coefficient increases, but manufacturing process limitations arise
Solution Approach 1:
The patent embeds a magnetic core structure within the coil assembly, where the magnetic core is positioned inside the coil winding. This nesting approach allows the magnetic core to enhance the coupling coefficient without requiring the coils to be physically closer, thus avoiding manufacturing process limitations while achieving the desired magnetic coupling enhancement.
Solution Approach 2:
The patent introduces a magnetic core as an intermediary element between the coils. This magnetic core acts as a mediator that concentrates and directs magnetic flux, thereby increasing the coupling coefficient without requiring direct coil proximity. The magnetic core serves as the intermediate structure that enables enhanced coupling while maintaining manufacturability.
2Strength
If the coupling coefficient is increased by decreasing the interval between coils, then mutual inductance increases, but the mounted area cannot be reduced further
Solution Approach 1:
The patent transitions from increasing coupling through horizontal coil proximity (2D approach) to enhancing coupling through vertical magnetic flux concentration using a magnetic core (3D approach). This dimensional shift allows mutual inductance to be increased without requiring additional mounted area, as the enhancement is achieved through the third dimension of magnetic flux path optimization.
Solution Approach 2:
The patent employs a composite structure combining coil windings with a magnetic core material. This composite construction enables enhanced mutual inductance within the same footprint by utilizing the complementary properties of the coil structure and the magnetic core, thereby increasing coupling without expanding the mounted area.
3Loss of energy
If a coupled inductor structure is used to reduce inductor current ripple, then efficiency increases, but leakage inductance must be precisely matched
Solution Approach 1:
The patent utilizes the magnetic core to fundamentally change the magnetic circuit parameters, specifically increasing the magnetic permeability and concentrating magnetic flux. This parameter change approach allows the coupled inductor to achieve the desired leakage inductance characteristics without requiring precise dimensional adjustments, thereby improving efficiency while reducing the manufacturing precision requirements for inductance matching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively increases the coupling coefficient by up to 70%, reducing inductor current ripple and enhancing the efficiency of the coil electronic component without altering the coil interval, thereby improving the performance of DC to DC converters.
Implementation Method 1
a first magnetic core which is a magnetic core of the first coil, and the second insulating layer may include a through-hole forming a second magnetic core which is a magnetic core of the second coil
Implementation Method 2
a second coil sharing a magnetic core of the first coil and wound in a direction the same as or different to a direction in which the first coil is wound
Data Source
AI summary
A coil electronic component includes a first coil and a second coil disposed on and beneath a main board, respectively, wherein the first coil includes a first coil pattern and a second coil pattern connected to each other through a first via of a first insulating layer and disposed on and beneath the first insulating layer, respectively, and the second coil includes a third coil pattern and a fourth coil pattern connected to each other through a second via of a second insulating layer and disposed on and beneath the second insulating layer, respectively. In this case, the main board, the first insulating layer, and the second insulating layer include through-holes formed in central portions thereof, respectively.