Coil Component Height Reduction via Magnetic Sheath Sandwiching
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Solution Overview
Problem
The existing coil components with a structure of a coil around a magnetic core face challenges in reducing height due to spring-back phenomena of bent conductive wires, which can increase the effective height dimension and fail to meet modern height reduction demands.
Innovation Solution
The coil component design incorporates a magnetic core with a sheet part and a pillar part, featuring first and second conductive films for wire connections, a spiral coil with rectangular cross-section, and a magnetic sheath that covers and sandwiches the wire ends, providing enhanced stability and reducing height through precise wire placement and sandwiching structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the bent parts are accommodated within a groove formed on each metal film, then the spring-back effect is suppressed, but the height dimension of the coil component increases by the depth of the groove
Solution Approach 1:
The patent transitions from suppressing spring-back in the vertical dimension (groove depth) to managing it in the horizontal dimension by allowing the bent part to extend beyond the metal film edge. The bent part is positioned to extend in the planar direction rather than being constrained vertically, thus reducing height while maintaining stability through proper positioning and anchoring.
2Length of stationary object
If the bent part is allowed to extend beyond the metal film edge, then the height dimension is reduced, but the spring-back effect may cause instability in the connection
Solution Approach 1:
The connection structure is segmented into distinct functional zones: the metal film provides electrical connection, the bent part provides mechanical anchoring with controlled extension beyond the metal film edge, and the coil winding provides additional constraint. This segmentation allows each element to perform its specific function optimally - the bent part extends horizontally to reduce height while remaining anchored to maintain stability.
3Ease of manufacture
If conventional joining methods are used with bent parts, then the coil component can be assembled, but thermal expansion and contraction cause displacement of the joined parts
Solution Approach 1:
The patent changes the geometric parameters of the bent part - specifically its length, curvature radius, and extension distance beyond the metal film edge. These parameter changes create a more robust mechanical connection that accommodates thermal expansion and contraction forces, preventing displacement while maintaining assembly feasibility through standard joining processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the height of the coil component and maintains stable connections by suppressing thermal expansion and contraction effects, ensuring reliable operation and adherence to modern size requirements.
Implementation Method 1
maintains stable connections by suppressing thermal expansion and contraction effects
Data Source
AI summary
As an embodiment, a pair of first conductive films 12, 13 are formed from the side face to the bottom face of the sheet part 11a of a magnetic core 11, and one end 14b of the conductive wire of the coil 14 and the other end 14c of the conductive wire are joined to the side faces 12a, 13a of the first conductive films 12, 13, respectively. Also, as an embodiment, the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the part 15a of the magnetic sheath 15 covering the side face of the sheet part 11a of the magnetic core 11, wherein the parts of the magnetic sheath 15 covering the joined parts 14b1, 14c1 are sandwiched by the side faces 12a, 13a of the first conductive films 12, 13 and the side faces 16a, 17a of second conductive films 16, 17 as well as the side faces 18a, 19a of third conductive films 18, 19.