Coil Component Shielding Structure for Leakage Magnetic Flux Reduction
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Solution Overview
Problem
The increasing demand for miniaturization and high performance in electronic devices has led to a need for effective noise reduction from electromagnetic interference (EMI) in electronic components, where existing coil components fail to adequately mitigate leakage magnetic flux.
Innovation Solution
A coil component design featuring a body with a coil part embedded inside, covered by an insulating layer, and equipped with first and second plating electrodes and through electrodes, which are strategically positioned to form a shielding structure that reduces leakage magnetic flux by providing a conductive path for electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a coil component is designed with traditional structure, then the manufacturing process is simple, but the leakage magnetic flux cannot be effectively reduced
Solution Approach 1:
The coil component is segmented into distinct functional layers: a body containing the coil part, an insulating layer covering the body, and plating electrodes disposed between the body and insulating layer. This segmentation allows each layer to perform its specific function - the plating electrodes provide EMI shielding while the insulating layer provides electrical isolation, effectively reducing leakage magnetic flux without requiring complete structural redesign.
Solution Approach 2:
The plating electrodes serve as an intermediary shielding structure between the coil part and the external environment. These electrodes, disposed between the body and the insulating layer, create a conductive barrier that intercepts and redirects leakage magnetic flux, preventing it from propagating outward while maintaining the overall structural integrity of the component.
2Object-affected harmful factors
If shielding structures are added to reduce leakage magnetic flux, then noise reduction capability is improved, but manufacturing complexity increases
Solution Approach 1:
The plating electrodes are merged with the existing layered structure of the coil component, combining the shielding function with the insulating layer and body. By integrating the EMI shielding capability into the existing manufacturing flow - where plating electrodes are disposed between the body and insulating layer - the design achieves noise reduction without requiring entirely separate manufacturing processes.
Solution Approach 2:
The insulating layer serves multiple functions: it provides electrical insulation between the plating electrodes and the external environment, and simultaneously serves as a structural support layer. This multi-functionality reduces the need for additional dedicated shielding structures, simplifying the overall manufacturing process while maintaining EMI protection capabilities.
3Ease of operation
If plating electrodes are disposed between body and insulating layer, then mounting ease is improved, but risk of electrical short-circuit increases
Solution Approach 1:
The insulating layer acts as an intermediary barrier between the conductive plating electrodes and other conductive elements. By positioning the plating electrodes between the body and the insulating layer, the insulating layer provides a protective buffer that prevents direct contact between conductive parts, thereby reducing electrical short-circuit risk while maintaining the mounting advantages provided by the plating electrodes.
Solution Approach 2:
The insulating layer provides localized electrical isolation precisely where needed - between the plating electrodes and the external environment. This targeted insulation approach ensures that electrical isolation is provided at critical interfaces without requiring complete insulation of the entire component, maintaining mounting ease while preventing electrical short-circuits at vulnerable points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described coil component effectively reduces leakage magnetic flux, enhancing noise reduction capabilities and facilitating easier mounting while minimizing the risk of electrical short-circuits, thus supporting the miniaturization and performance requirements of electronic devices.
Implementation Method 1
first and second plating electrodes are disposed between the body and the insulating layer, connected to the coil part, and disposed to be spaced apart from each other on one surface of the body. First and second through electrodes penetrate through the insulating layer to thereby be connected to the first and second plating electrodes, respectively
Data Source
AI summary
A coil component includes a body, a coil part embedded in the body, and an insulating layer covering the body. First and second plating electrodes are disposed between the body and the insulating layer, are connected to the coil part, and are disposed to be spaced apart from each other on one surface of the body. First and second through electrodes penetrate through the insulating layer to thereby be connected to the first and second plating electrodes, respectively.