Coil Component Shielding Layer Gap Design
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Solution Overview
Problem
In electronic devices, the increasing demand for miniaturization and high-performance components leads to higher requirements for reducing electromagnetic interference (EMI) leakage magnetic flux, which current shielding technologies struggle to effectively address while maintaining component characteristics.
Innovation Solution
A coil component design featuring a body with a shielding layer, external electrodes, and a gap portion to minimize leakage magnetic flux, where the shielding layer is integrated onto the body's surfaces except the mounting surface, and the gap portion prevents electrical short-circuits, allowing efficient EMI shielding without compromising component characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a general EMI shielding technology is used where the electronic component and board are simultaneously enclosed by a shield can, then electromagnetic interference shielding is achieved, but the component size increases and manufacturing complexity increases
Solution Approach 1:
The shielding layer is integrated directly onto the body of the coil component, with the cap portion disposed on the second surface and side wall portions disposed on the wall surface. This nested structure allows the shielding function to be embedded within the component itself, eliminating the need for an external shield can and thereby reducing overall component size while maintaining EMI shielding effectiveness.
Solution Approach 2:
The shielding layer is merged with the body structure, where the cap portion and side wall portions form an integrated shielding structure that is disposed directly on the component body. This merging of the shielding function with the component body eliminates separate shielding structures and reduces manufacturing steps, thereby decreasing manufacturing complexity while achieving effective EMI shielding.
2Object-affected harmful factors
If a shield can is used to enclose the electronic component and board, then electromagnetic interference shielding is achieved, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The shielding layer is merged with the body structure, where the cap portion and side wall portions form an integrated shielding structure that is disposed directly on the component body. This merging of the shielding function with the component body eliminates separate shielding structures and reduces manufacturing steps, thereby decreasing manufacturing complexity while achieving effective EMI shielding.
Solution Approach 2:
The coil component itself provides the shielding function through its integrated shielding layer, rather than requiring external shielding structures. The shielding layer is formed as part of the component manufacturing process, allowing the component to shield itself from EMI without additional manufacturing steps or external structures, thereby simplifying the overall manufacturing process.
3Object-affected harmful factors
If the shielding layer is disposed close to the body to maximize shielding effect, then EMI shielding is improved, but electrical short-circuits between the shielding layer and external electrodes may occur
Solution Approach 1:
The shielding layer is disposed close to the body to maximize shielding effect, but the gap portion is strategically positioned at specific locations where electrical short-circuits could occur. This local modification maintains the overall shielding effectiveness while preventing electrical short-circuits between the shielding layer and external electrodes, thereby resolving the contradiction between shielding performance and electrical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces leakage magnetic flux, enhances EMI shielding, and prevents electrical short-circuits, thereby supporting the miniaturization and high-performance needs of electronic devices while maintaining component characteristics.
Implementation Method 1
a shielding layer including a cap portion disposed on the second surface of the body and side wall portions disposed on the wall surface of the body
Data Source
AI summary
A coil component includes: a body having a first surface and a second surface opposing each other in a thickness direction of the body and a wall surface connecting the first and second surfaces; a coil part including coil patterns and including at least one turn centered on the thickness direction; external electrodes disposed on the first surface of the body and electrically connected to the coil part; a shielding layer including a cap portion disposed on the second surface of the body and side wall portions disposed on the wall surface of the body and each having a first end connected to the cap portion; an insulating layer disposed between the body and the shielding layer; and a gap portion bounded by a second end of the shielding layer opposing the first end and the first surface of the body to expose portions of the wall surface.


