Coil Component Lead-Out Slit Design for Dicing Stability
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Solution Overview
Problem
In the miniaturization of coil electronic components, there is a challenge in preventing the lead-out portion from being pushed to the surface during the dicing process due to the ductility of metal components and external forces, which can lead to bleeding and increased size issues.
Innovation Solution
A coil electronic component design featuring a body with a magnetic material and insulating substrate, where lead-out portions are extended from the coil portion and exposed on the surface with slits to prevent pushing, and the use of dummy patterns for improved adhesion and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lead-out portion is made of metal component with ductility, then the component can be formed through plating method, but the metal component is pushed to the surface during dicing process due to external force
Solution Approach 1:
The lead-out portion is divided into multiple segments by forming slits, which separates the continuous metal structure into discrete sections. This segmentation prevents the metal from being pushed as a unified structure during dicing, thereby resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
The slit structure creates local variations in the lead-out portion, with some areas having reduced metal continuity. This local modification allows the lead-out portion to maintain overall structural integrity while preventing surface pushing at critical locations during dicing.
2Volume of moving object
If the overall size of the coil electronic component is reduced for miniaturization, then the component becomes more compact, but the lead-out portion is more easily pushed to the surface during dicing
Solution Approach 1:
By segmenting the lead-out portion through slits, the structure becomes more resistant to pushing forces even in miniaturized components. The segmented design distributes the stress during dicing, preventing the lead-out portion from being pushed to the surface despite the reduced overall component size.
Solution Approach 2:
The slits are formed in advance before the dicing process, preparing the lead-out portion to resist pushing forces. This preliminary structural modification ensures that even when the component is miniaturized, the lead-out portion maintains its position stability during subsequent dicing operations.
3Manufacturing precision
If slits are formed in the lead-out portion, then the lead-out portion is prevented from being pushed to the surface, but the structure becomes more complex
Solution Approach 1:
The segmentation through slits adds structural complexity only where necessary - in the lead-out portion - while leaving the rest of the component simple. This targeted segmentation prevents surface pushing without requiring complex modifications throughout the entire device.
Solution Approach 2:
The slit structure introduces complexity locally in the lead-out portion while maintaining simplicity in other areas. This localized approach prevents surface pushing without significantly increasing the overall device complexity, as the slits are confined to specific regions rather than affecting the entire component structure.
Data Source
AI summary
A coil electronic component includes a body comprising a magnetic material, an insulating substrate comprising a support portion disposed inside the body, and a tip extending from the support portion and exposed from an external surface of the body, a coil portion disposed on the support portion, and a lead-out portion extending from one end of the coil portion, disposed on the tip, and exposed from the external surface of the body. The lead-out portion has a slit exposed from the external surface of the body.