Coil Component Multilayer Body Stress Relaxation
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Solution Overview
Problem
Existing coil components with multiple glass-containing insulating layers face challenges in producing low-profile chips and achieving high impedance due to increased chip height and reduced magnetic layer thickness, which complicates stress relaxation and electrical characteristic improvement during co-firing.
Innovation Solution
A coil component design featuring a multilayer body with optimized thickness and distance ranges for outer and inner insulators and magnetic bodies, including a Ni-Cu-Zn-based ferrite structure and alkali borosilicate glass, to reduce stress and enhance electrical characteristics while maintaining a low-profile form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If two insulating layers containing glass component are disposed in each oxide magnetic layer, then stress relaxation during co-firing is improved, but chip height increases and magnetic layer thickness is reduced
Solution Approach 1:
The patent extracts the glass component from the insulating layers and applies it specifically to the inner insulator, removing the need for multiple glass-containing layers in oxide magnetic layers. This reduces chip height while maintaining stress relaxation benefits through the concentrated glass composition in the inner insulator.
Solution Approach 2:
The patent applies glass component locally to the inner insulator rather than distributing it across multiple insulating layers. This localized application provides sufficient stress relaxation at the critical interface while minimizing overall chip height and preserving magnetic layer thickness.
2Stability of the object's composition
If two insulating layers containing glass component are disposed in each oxide magnetic layer, then stress relaxation during co-firing is improved, but magnetic layer thickness is reduced making it difficult to increase impedance
Solution Approach 1:
The patent extracts the glass component from the insulating layers and applies it specifically to the inner insulator, removing the need for multiple glass-containing layers in oxide magnetic layers. This reduces chip height while maintaining stress relaxation benefits through the concentrated glass composition in the inner insulator.
Solution Approach 2:
The patent applies glass component locally to the inner insulator rather than distributing it across multiple insulating layers. This localized application provides sufficient stress relaxation at the critical interface while minimizing overall chip height and preserving magnetic layer thickness.
3Stability of the object's composition
If outer insulator thickness is increased to reduce stress on inner insulator, then stress relaxation is improved, but chip height increases reducing low-profile capability
Solution Approach 1:
The patent applies glass component locally to the inner insulator rather than distributing it across multiple insulating layers. This localized application provides sufficient stress relaxation at the critical interface while minimizing overall chip height and preserving magnetic layer thickness.
Solution Approach 2:
The patent uses a composite material consisting of ferrite and glass component in the inner insulator. This composite provides effective stress relaxation through the glass component while maintaining a compact structure that achieves low-profile chip dimensions.
Data Source
AI summary
A coil component includes a multilayer body that includes a first outer magnetic body, a first outer insulator, a first inner magnetic body, an inner insulator, a second inner magnetic body, a second outer insulator, and a second outer magnetic body which are stacked sequentially in the stacking direction and a coil disposed inside the inner insulator. A thickness of the first outer insulator is from about one-fifteenth to one-seventh a total thickness of the first outer magnetic body, the first outer insulator, and the first inner magnetic body. Also, a thickness of the second outer insulator is from about one-fifteenth to one-seventh a total thickness of the second outer magnetic body, the second outer insulator, and the second inner magnetic body.