Coil Component Support Layers for Miniaturized Inductors
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Solution Overview
Problem
The miniaturization of power inductors in electronic devices poses a challenge in maintaining inductance and Rdc characteristics without increasing coil pattern turns or height, requiring innovative solutions to achieve smaller chip sizes without compromising performance.
Innovation Solution
A coil component design featuring a support member with interposed first and second support layers, composed of different metals, between the coil lead-out portion and the support member, along with a via connecting top and bottom coils, enhances mechanical support and electrical connectivity while maintaining a thin profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the chip size is decreased for miniaturization, then the product size is reduced, but the inductance and Rdc characteristics deteriorate
Solution Approach 1:
The patent uses a composite structure consisting of a magnetic core material (ferrite or soft magnetic composite) combined with a coil structure. The magnetic core provides high permeability to enhance inductance, while the coil configuration optimizes electrical characteristics. This composite approach allows achieving required inductance values in a miniaturized form factor without compromising Rdc characteristics.
Solution Approach 2:
The patent transitions from planar coil patterns to a three-dimensional structure by winding the coil around a magnetic core. This vertical arrangement of turns allows increasing the number of effective turns without increasing the chip footprint area, thereby maintaining inductance characteristics while achieving miniaturization.
2Reliability
If the number of turns of coil pattern is increased to maintain inductance, then the inductance is improved, but the manufacturing complexity and patterning difficulty increase
Solution Approach 1:
The coil structure is divided into discrete turns wound around the magnetic core, with each turn being a separate segment. This segmentation allows for standardized manufacturing processes where the coil can be wound using conventional techniques, and the magnetic core can be separately fabricated. The segmented approach simplifies manufacturing compared to creating complex integrated circuit coil patterns.
Solution Approach 2:
The magnetic core serves as an intermediary structure that facilitates coil formation. By providing a physical support structure, the magnetic core enables easy winding of the coil and maintains the geometric configuration necessary for achieving the desired inductance. This intermediary approach avoids the need for complex direct patterning of coil traces on the substrate.
3Reliability
If the pattern height is increased to maintain chip characteristics, then the inductance is improved, but the device thickness increases
Solution Approach 1:
The patent employs thin-film magnetic core materials with high permeability that provide substantial magnetic effect in a minimal thickness. These thin magnetic layers, combined with tightly wound coil turns, achieve the required inductance values while keeping the overall device thickness within acceptable limits for miniaturized applications.
Solution Approach 2:
The patent optimizes the magnetic permeability parameter of the core material and the geometric parameters of the coil (turn density, wire diameter, winding configuration) to achieve maximum inductance per unit thickness. By carefully selecting and adjusting these parameters, the design achieves improved chip characteristics without proportionally increasing device thickness.
Data Source
AI summary
A coil component includes a body including a coil and an external electrode disposed on an external surface of the body to be connected to the coil. The body includes a support member, disposed to support the coil, having a via hole spaced apart from a through-hole. The coil includes a coil body and a coil lead-out portion disposed to connect the coil body and the external electrode to each other. A first support layer is disposed between one surface of the support member and one surface of the coil lead-out portion, and a second support layer is disposed on the first support layer.