3D Coil Component for Compact Thermal Management
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Solution Overview
Problem
The challenge is to design a coil component that reduces its mounting area while maintaining the volumes of magnetic material and coil portion, and improves heat dissipation properties, which is essential for high-performance electronic devices with reduced sizes.
Innovation Solution
The coil component features a body with a support substrate, a coil portion with lead-out portions exposed on both surfaces, and external electrodes connected to these lead-out portions, allowing for efficient heat dissipation and reduced mounting area by utilizing a hexahedral shape with a thickness greater than width, and incorporating magnetic materials and insulating films for improved thermal conductivity and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the size of coil component is reduced, then the mounting area is reduced, but the volumes of magnetic material and coil portion must be maintained to secure inductance and quality factor
Solution Approach 1:
The patent applies dimensionality change by transitioning from a planar coil configuration to a three-dimensional立体 structure. The coil portion extends in the thickness direction of the body, utilizing the vertical dimension to increase effective coil volume and magnetic material volume without increasing the planar mounting area. This allows maintaining inductance and quality factor while reducing the footprint area.
2Area of stationary object
If the size of coil component is reduced, then the mounting area is reduced, but heat dissipation properties must be improved
Solution Approach 1:
The patent utilizes the thickness direction as an additional dimension for heat dissipation. The lead-out portions extend to both first and second surfaces of the body in the thickness direction, creating multiple heat dissipation paths. This three-dimensional heat dissipation structure allows efficient thermal management while maintaining a reduced planar mounting area.
3Area of stationary object
If the coil portion is disposed to extend in the thickness direction, then the mounting area is reduced, but the structural complexity increases
Solution Approach 1:
The patent merges multiple functions into integrated structures. The support substrate is disposed within the body and provides both mechanical support for the coil portion and a foundation for heat dissipation. The lead-out portions serve dual purposes as both electrical connections and heat dissipation pathways. This integration reduces the number of separate components and simplifies the overall manufacturing process despite the three-dimensional configuration.
Data Source
AI summary
A coil component includes a body having both end surfaces opposing each other in a length direction; a support substrate disposed in the body; a coil portion disposed on the support substrate in a width direction of the body, and including first and second lead-out portions each exposed to a first surface and a second surface of the body opposing each other in a thickness direction of the body, respectively, and disposed on the support substrate; and first and second external electrodes disposed on the first surface of the body, spaced apart from each other, and connected to one ends of the first and second lead-out portions exposed to the first surface of the body, respectively.