Coil Component Thermal Expansion Mismatch Warpage
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Solution Overview
Problem
High-speed electronic devices are prone to signal distortion due to high-frequency noise, and existing common mode filters face challenges in achieving narrowband characteristics and attenuation in high frequency bands while maintaining mountability and preventing defects like warpage and short circuits during soldering.
Innovation Solution
A coil component with a magnetic substrate, an insulating layer, and a reinforcing layer with a lower coefficient of thermal expansion, formed of non-magnetic polymer resin and inorganic fillers, which improves thermal expansion mismatch and reduces magnetic loss, and features external electrodes for enhanced connectivity and reduced risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a coil layer is directly exposed to air without a separate magnetic member such as a ferrite-resin composition layer, then magnetic loss is significantly reduced, but mountability is deteriorated and short circuits between electrodes may occur
Solution Approach 1:
The patent applies composite materials by combining ferrite particles with resin to create a ferrite-resin composition layer. This composite structure provides both magnetic shielding properties (reducing magnetic loss) and mechanical support (improving mountability and preventing short circuits), resolving the contradiction between energy loss reduction and reliability enhancement.
2Loss of energy
If high frequency bands are targeted for noise removal, then attenuation characteristics are improved, but narrowband characteristics become more difficult to achieve
Solution Approach 1:
The patent employs parameter changes by optimizing the ferrite particle size distribution, resin type, and layer thickness to achieve both high-frequency attenuation and narrowband characteristics. By carefully controlling these parameters, the filter can effectively target specific high-frequency noise bands while maintaining selectivity.
3Stability of the object's composition
If deviations in coefficient of thermal expansion between members are reduced, then warpage defects are prevented, but device complexity increases
Solution Approach 1:
The patent directly addresses thermal expansion issues by selecting resin materials with coefficients of thermal expansion matched to the ferrite and PCB substrate. The ferrite-resin composition layer acts as a thermal expansion buffer, compensating for mismatches between different materials and preventing warpage during temperature variations in the soldering process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coil component achieves high attenuation characteristics, improved mountability, and reduced warpage, ensuring stable performance and reliability in high-frequency applications.
Implementation Method 1
a reinforcing layer provided on the insulating layer and having a coefficient of thermal expansion lower than a coefficient of thermal expansion of the insulating layer
Implementation Method 2
a coil component for removing common mode noise
Data Source
AI summary
A coil component includes a magnetic substrate, an insulating layer provided on the magnetic substrate and having conductive coils formed in the insulating layer, and a reinforcing layer provided on the insulating layer and having a coefficient of thermal expansion lower than a coefficient of thermal expansion of the insulating layer. High attenuation characteristics and mountability of a coil component may be improved and the deviation of the coefficient of thermal expansion between the components may be alleviated.