Multilayer Coil Component Connection Conductor Width

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Solution Overview

Problem

Multilayer coil components face issues with cracks in the insulation layer due to thermal stress caused by differences in the coefficients of linear expansion between conductors and insulative materials during heat treatment, particularly at connection portions where tensile stress exceeds the strength of the insulation layer.

Innovation Solution

A multilayer coil component design where the conductor width of the connection conductor is smaller than that of adjacent coil conductors, reducing displacement and tensile stress in the insulation layer, thereby minimizing the likelihood of crack formation. This design includes specific width ratios and ranges for the connection conductor and coil conductors to prevent disconnection and ensure structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the conductor width of the connection conductor is made equal to or larger than that of adjacent coil conductors, then the electrical connectivity is improved, but thermal stress concentrates in the insulation layer causing cracks during heat treatment

Engineering Contradiction:
Improveelectrical connectivityVSAvoidthermal stress concentration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The connection conductor is designed with a smaller conductor width specifically at the connection portion where it joins adjacent coil conductors, while maintaining adequate width in other regions for electrical connectivity. This local variation in dimension reduces thermal stress concentration in the insulation layer at the connection portion during heat treatment, preventing cracks while preserving electrical functionality.

Inventive Principle:
Principle #3Local quality

2Object-affected harmful factors

If the conductor width of the connection conductor is reduced to minimize thermal stress, then crack occurrence is reduced, but the electrical connectivity and current carrying capacity may be compromised

Engineering Contradiction:
Improvecrack occurrenceVSAvoidelectrical connectivity
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The connection conductor exhibits different width characteristics at different locations: a smaller width at the connection portion to reduce thermal stress and prevent insulation layer cracks, and an adequate width in the extension portions to maintain electrical connectivity and current carrying capacity. This spatial variation in geometric properties resolves the contradiction between stress reduction and electrical functionality.

Inventive Principle:
Principle #3Local quality

3Object-affected harmful factors

If the conductor width of the connection conductor is made smaller than adjacent coil conductors, then the displacement and tensile stress in the insulation layer are reduced, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvetensile stress in insulation layerVSAvoidconductor width control
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The invention specifies a particular parameter relationship where the conductor width of the connection conductor is made smaller than that of adjacent coil conductors. This parameter change effectively reduces the displacement and tensile stress in the insulation layer during heat treatment. The patent provides specific width relationships to guide manufacturing while balancing precision requirements with stress reduction benefits.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed design effectively reduces the occurrence of cracks in the insulation layer at connection portions, maintaining the structural integrity and electrical connectivity of the multilayer coil component by managing stress through controlled conductor width relationships.

Implementation Method 1

thermal stress, caused by a difference in coefficients of linear expansion between the conductor and the insulative material, is concentrated in the connection portion during heat treatment in a step of processing the multilayer coil component, particularly in a temperature decreasing process in which temperature varies from high to low

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20230253142A1Multilayer coil component
Publication Date: 2023.08.10 MURATA MFG CO LTD
  • US20230253142A1 patent drawing
  • US20230253142A1 patent drawing
  • US20230253142A1 patent drawing

AI summary

A multilayer coil component includes a multilayer body that is formed by laminating a plurality of insulation layers and that includes a coil inside thereof and outer electrodes provided on an outer surface of the multilayer body and electrically connected to the coil. The coil is formed by connecting a plurality of coil conductors, laminated together with insulation layers, via a connection conductor. At a connection portion at which the first coil conductor and the second coil conductor, being coil conductors adjacent to each other, are connected via the connection conductor, a conductor width of the connection conductor is smaller than a conductor width of the first coil conductor and a conductor width of the second coil conductor is smaller than the conductor width of the first coil conductor.