Lamp Coil Core Heat Conduction Structure for Thermal Dissipation
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Solution Overview
Problem
Existing operating devices for lamps, particularly LED lamps, face inefficiencies in heat dissipation from coils, leading to increased temperatures that can shorten the lifespan of electrical and electronic components and limit their use in higher ambient temperatures.
Innovation Solution
A heat-conducting structure in flat contact with the coil core efficiently transfers heat away from the coil core to a heat-dissipating element, such as a heat sink, improving cooling efficiency and protecting adjacent components by directing waste heat away from sensitive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal paste is used to conduct heat from the coil core to the housing, then heat conduction is achieved, but the heat dissipation effectiveness is poor and the cost is relatively high
Solution Approach 1:
A heat conduction structure serves as an intermediary component between the coil core and the housing. This mediator provides a dedicated thermal pathway that is more effective than thermal paste while being more cost-effective and manufacturable than direct metal-to-metal contact solutions.
Solution Approach 2:
The heat conduction structure changes the thermal conduction parameter by providing a structured pathway with optimized thermal conductivity. Instead of relying on paste material properties or direct contact assumptions, the structure itself is designed to control and enhance heat flow from the coil core to the housing.
2Duration of action of stationary object
If the coil core operates without efficient heat dissipation, then the device structure remains simple, but the temperature increases which shortens the service life of electrical and electronic components
Solution Approach 1:
The heat conduction structure extracts heat from the coil core region and redirects it to the housing. By separating the heat generation zone (coil core) from the heat accumulation zone and providing a dedicated extraction pathway, the structure prevents temperature buildup that would otherwise degrade components and shorten their service life.
3Reliability
If heat is not effectively conducted away from the coil core, then the device can be used in higher ambient temperatures, but the high temperature affects other electrical and electronic components reducing reliability
Solution Approach 1:
The heat conduction structure converts the harmful waste heat generated by the coil core into a beneficial controlled thermal flow. By providing a dedicated pathway, the structure transforms uncontrolled heat radiation that damages components into a directed thermal current that exits through the housing, thereby protecting sensitive electronics while maintaining device reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the cooling efficiency of the coil core, increases the lifespan and reliability of the operating device, and allows its use in higher ambient temperatures by effectively managing heat dissipation.
Implementation Method 1
a heat conduction structure which is in planar contact with the coil core in order to conduct the heat emitted by the coil core during operation of the coil away from the coil core
Data Source
Figure 1~2
Figure 3~4
AI summary
The present invention relates to a control device (1) for a lamp, in particular for an LED lamp, wherein the control device (1) comprises: a coil (2) with a coil core (3), and a heat conducting structure (4, 4') which is in planar contact with the coil core (3) in order to conduct the heat emitted by the coil core (3) during operation of the coil (2) away from the coil core (3).