Coil Core Layout for Heat Dissipation Without Thermal Stress
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Solution Overview
Problem
Existing coil devices face challenges in reducing thermal stress at the core, which is exacerbated by exposure of core portions to ambient air and temperature gradients within the heat-dissipating resin.
Innovation Solution
The coil device incorporates a core design with a middle leg portion and first base portion, where 70% or more of the middle leg portion's volume is below the venting surface of the heat-dissipating resin, and the first base portion is positioned apart from the middle leg portion to prevent stress transfer, even if partially exposed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large portion of the core is covered with the heat-dissipating resin, then heat dissipation effect is improved, but the case size becomes too large
Solution Approach 1:
The patent applies local quality by selectively immersing only the middle leg portion (70% or more of its volume) in the heat-dissipating resin, while leaving the first and second base portions exposed. This localized heat dissipation approach optimizes cooling where it is most needed (at the winding portion) while avoiding the need to increase case size to cover the entire core.
2Volume of stationary object
If the case size is reduced to minimize wire winding portion immersion, then case size is reduced, but thermal stress is generated at the core
Solution Approach 1:
The patent segments the core into distinct portions (middle leg portion and base portions) with different thermal management treatments. The middle leg portion is immersed in heat-dissipating resin while base portions are exposed, creating a segmented thermal management strategy that reduces thermal stress by avoiding excessive cooling of the entire core structure.
Solution Approach 2:
By applying heat dissipation only to the middle leg portion where the winding generates heat, rather than uniformly cooling the entire core, the patent creates localized thermal management that prevents thermal stress while maintaining compact case size.
3Temperature
If there is a large difference in cooling temperature along the winding axis, then heat dissipation is enhanced, but excessive thermal stress is generated at the core
Solution Approach 1:
The patent applies local quality by selectively cooling the middle leg portion while leaving base portions uncooled, creating a controlled temperature gradient that enhances heat dissipation from the winding area without generating excessive thermal stress through uniform over-cooling of the entire core.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation and reduces excessive thermal stress at the core, improving durability and allowing for a smaller case size with reduced heat-dissipating resin usage.
Implementation Method 1
most of the volume of the winding portion, disposed around the middle leg portion, of the wire as well as the middle leg portion is cooled by the heat-dissipating resin
Data Source
AI summary
A coil device includes a core containing a magnetic material and a wire disposed in a coil shape around at least a part of the core. The core includes a middle leg portion and a first base portion. The middle leg portion has a winding portion of the wire disposed therearound. The first base portion is disposed apart by a predetermined distance from one end of the middle leg portion along a winding axis of the winding portion. 70% or more, preferably 80% or more, more preferably 90% or more, or still more preferably 95% or more of a volume of the middle leg portion is located below a venting surface of a heat-dissipating resin.