Coil-Fed Sheet Cutting with In-Process Piece and Swarf Separation
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Solution Overview
Problem
Existing laser or plasma cutting technologies for laminar material wound in coil require separate areas for separating machined pieces from swarf and skeleton, leading to increased device size and potential deformations or abrasions of machined pieces during collection.
Innovation Solution
An apparatus with a movable collection device that separates machined pieces from swarf and skeleton directly in the cutting area, using a programmable control unit to coordinate cutting phases and position the collection device to minimize interference with swarf fall and optimize piece collection, allowing for compact design and reduced deformation risk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate areas are used for separating machined pieces from swarf and skeleton, then separation effectiveness is improved, but device size increases
Solution Approach 1:
The patent merges the separation function into the cutting area by positioning a collection device directly beneath the cutting plane. The collection device collects machined pieces that fall from the cutting plane, while swarf falls through gaps in the collection device into a receiving cavity below, achieving separation of pieces from swarf within the same cutting area without requiring separate separation areas.
Solution Approach 2:
The patent utilizes the vertical dimension by positioning the collection device at a specific height below the cutting plane and the receiving cavity further below. This vertical arrangement allows machined pieces to be collected on the collection device while swarf falls through to the receiving cavity, achieving separation through spatial positioning in the vertical dimension rather than requiring separate horizontal areas.
2Productivity
If machined pieces are collected after cutting, then collection efficiency is improved, but risk of deformations and abrasions increases
Solution Approach 1:
The patent implements preliminary action by having the collection device positioned and ready to receive machined pieces immediately as they fall from the cutting plane during the cutting process. This immediate collection prevents pieces from falling further and potentially deforming or abrading, while the collection device can be programmed to operate at optimal times to maximize collection efficiency.
3Manufacturing precision
If collection device is positioned close to cutting plane, then deformation risk is reduced, but interference with swarf fall increases
Solution Approach 1:
The collection device features a perforated structure with gaps that allow swarf to pass through while supporting machined pieces. This local quality variation in the collection device structure enables it to simultaneously minimize deformation risk for pieces by being positioned close to the cutting plane, while allowing swarf to fall through the gaps to the receiving cavity below without interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables compact apparatus design with direct separation of machined pieces from swarf and skeleton in the cutting area, minimizing the risk of deformations and abrasions while maintaining efficient operation.
Implementation Method 1
laser or plasma cutting
Implementation Method 2
laser or plasma cutting
Implementation Method 3
letting said swarf fall by gravity into said receiving cavity
Data Source
AI summary
A method and apparatus for laser or plasma cutting of pieces from laminar material wound in coil is provided. The apparatus provides a cutting station, with an operative cutting area and a receiving cavity, means for positioning and holding the laminar material suspended in the operative area above the receiving cavity during cutting operations, an electronic control unit and movable device for selective collection of the machined pieces. The electronic control unit controls the movement of the movable device between an active and a passive position so that that the movable device is in passive position when the cutting head is performing cutting operations generating swarf, letting such swarf to fall inside the cavity, and is in active position when the cutting head is performing cutting operations to detach pieces from the laminar material skeleton, to collect the pieces separately from the swarf and the skeleton.